公开(公告)号：US20250041589A1

公开(公告)日：2025-02-06

申请号：US18909328

申请日：2024-10-08

Applicant: Medtronic, Inc.

Inventor： David J. Peichel ,  Ramesh Raghupathy

IPC: A61M60/875 ,  A61M60/90 ,  H02J7/02 ,  H02J50/00 ,  H02J50/10 ,  H02J50/90

Abstract: An external coil system for a transcutaneous energy transfer system (TETS), the external coil being configured to transfer energy sufficient to power and implantable blood pump. The system includes a housing containing the external coil, the housing includes a thermal insulating base, the external coil being partially disposed within the thermal insulating base and a thermally conductive plastic, the external coil being partially disposed within the thermally conductive plastic.

公开(公告)号：US20220023515A1

公开(公告)日：2022-01-27

申请号：US16935433

申请日：2020-07-22

Applicant: Medtronic, Inc.

Inventor： Michael D. Eggen ,  Yong K. Cho ,  Avram Scheiner ,  Ramesh Raghupathy ,  Thomas W. Radtke

IPC: A61M1/10 ,  A61M1/12

Abstract: A method of cooling a mammal with an implantable blood pump. The method includes measuring a temperature of an internal controller, the internal controller being in communication with the implantable blood pump. an alert is generated if the temperature of the internal controller exceeds a predetermined temperature threshold.

公开(公告)号：US20230013106A1

公开(公告)日：2023-01-19

申请号：US17378051

申请日：2021-07-16

Applicant: Medtronic, Inc.

Inventor： Kevin R. Seifert ,  Lisa A. Meyer ,  Ramesh Raghupathy

IPC: A61M60/878 ,  H01R13/46 ,  A61M60/873 ,  A61M60/178 ,  A61M60/216 ,  A61M60/508

Abstract: A header for a controller for an implantable medical device. The header includes at least one bore sized and configured to receive a corresponding connector for the implantable medical device. At least one elongate thermally conducting element is disposed within the header and proximate the at least one bore, the at least one elongate thermally conducting element being configured to conduct heat away from the at least one bore and spread heat within the header when the corresponding connector is received within the at least one bore and is communication with the implantable medical device.

公开(公告)号：US20210346682A1

公开(公告)日：2021-11-11

申请号：US17246763

申请日：2021-05-03

Applicant: Medtronic, Inc.

Inventor： David J. Peichel ,  Ramesh Raghupathy

IPC: A61M60/875 ,  H02J50/10 ,  H02J50/00 ,  H02J50/90 ,  H02J7/02 ,  A61M60/90

Abstract: An external coil system for a transcutaneous energy transfer system (TETS), the external coil being configured to transfer energy sufficient to power and implantable blood pump. The system includes a housing containing the external coil, the housing includes a thermal insulating base, the external coil being partially disposed within the thermal insulating base and a thermally conductive plastic, the external coil being partially disposed within the thermally conductive plastic.

公开(公告)号：US12138442B2

公开(公告)日：2024-11-12

申请号：US17246763

申请日：2021-05-03

Applicant: Medtronic, Inc.

Inventor： David J. Peichel ,  Ramesh Raghupathy

IPC: A61M60/90 ,  A61M60/875 ,  H02J7/02 ,  H02J50/00 ,  H02J50/10 ,  H02J50/90

Abstract: An external coil system for a transcutaneous energy transfer system (TETS), the external coil being configured to transfer energy sufficient to power and implantable blood pump. The system includes a housing containing the external coil, the housing includes a thermal insulating base, the external coil being partially disposed within the thermal insulating base and a thermally conductive plastic, the external coil being partially disposed within the thermally conductive plastic.