公开(公告)号：US20150342060A1

公开(公告)日：2015-11-26

申请号：US14561248

申请日：2014-12-05

Applicant: Medtronic, Inc.

Inventor： Chunho KIM ,  Songhua SHI ,  Mark S. RICOTTA ,  Scott B. SLEEPER ,  Yongqian WANG

IPC: H05K3/28 ,  H05K5/06

CPC classification number: H05K3/284 ,  B29C45/14336 ,  B29C45/14639 ,  B29C45/14836 ,  H05K3/28 ,  H05K2203/1316 ,  H05K2203/1572

Abstract: During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system.

Abstract translation: 在将电子部件及其附接接口封装在混合组合件的基板的第一侧上的过程中，流体被供应到封装系统的沟槽，其中混合组件被加载，并且平衡压力由 在封装过程中，沟槽内的流体从衬底的相对的第二侧支撑混合组合件。 系统的流体供应的调节器可以保持平衡压力，例如由系统的控制器控制，该系统的控制器被配置为估计系统的模腔内的压力。