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公开(公告)号:US20250135211A1
公开(公告)日:2025-05-01
申请号:US18925265
申请日:2024-10-24
Applicant: Medtronic, Inc.
Inventor: Sadegh Behdad , Joachim Hossick-Schott , Rajesh V. Iyer , Andrew J. Thom
IPC: A61N1/375
Abstract: Feedthroughs, feedthrough assemblies, and methods of making the same for use in implantable medical devices are provided herein. Feedthroughs provided herein include a feedthrough ferrule, a feedthrough pin, and an electrically insulative metal oxide surface coating disposed on the feedthrough ferrule, disposed on the feedthrough pin, or disposed on both the feedthrough pin and the feedthrough ferrule.