公开(公告)号：US11938329B2

公开(公告)日：2024-03-26

申请号：US17372522

申请日：2021-07-12

Applicant: MEDTRONIC, INC.

Inventor： Steven Deininger ,  Jeffrey Clayton ,  Michael Baade ,  Anthony Chasensky

IPC: A61N1/375 ,  A61N1/36 ,  A61N1/05

CPC classification number: A61N1/3754 ,  A61N1/36062 ,  A61N1/37514 ,  A61N1/0551 ,  A61N1/36107 ,  A61N1/3756

Abstract: Implantable medical devices include circuitry positioned adjacent to header-related structures, rather than having the header and related structures sitting atop the position of the circuitry within a device housing. A circuit board within the device housing may be positioned adjacently to a lead bore of the header. Feedthrough conductors may extend from the circuitry to conductors of the header while being positioned adjacently to the circuit board. Lead frame conductors may extend to the electrical connectors of the lead bores while also being adjacent to the upper portion of the circuitry. Device height may be reduced by having the circuitry be positioned adjacent to one or more of the various header-related structures.

公开(公告)号：US20200254263A1

公开(公告)日：2020-08-13

申请号：US16273133

申请日：2019-02-11

Applicant: MEDTRONIC, INC.

Inventor： Steven Deininger ,  Jeffrey Clayton ,  Michael Baade ,  Anthony Chasensky

IPC: A61N1/375 ,  A61N1/36

Abstract: Implantable medical devices include circuitry positioned adjacent to header-related structures, rather than having the header and related structures sitting atop the position of the circuitry within a device housing. A circuit board within the device housing may be positioned adjacently to a lead bore of the header. Feedthrough conductors may extend from the circuitry to conductors of the header while being positioned adjacently to the circuit board. Lead frame conductors may extend to the electrical connectors of the lead bores while also being adjacent to the upper portion of the circuitry. Device height may be reduced by having the circuitry be positioned adjacent to one or more of the various header-related structures.

公开(公告)号：US11058882B2

公开(公告)日：2021-07-13

申请号：US16273133

申请日：2019-02-11

Applicant: MEDTRONIC, INC.

Inventor： Steven Deininger ,  Jeffrey Clayton ,  Michael Baade ,  Anthony Chasensky

IPC: A61N1/36 ,  A61N1/375 ,  A61N1/05

Abstract: Implantable medical devices include circuitry positioned adjacent to header-related structures, rather than having the header and related structures sitting atop the position of the circuitry within a device housing. A circuit board within the device housing may be positioned adjacently to a lead bore of the header. Feedthrough conductors may extend from the circuitry to conductors of the header while being positioned adjacently to the circuit board. Lead frame conductors may extend to the electrical connectors of the lead bores while also being adjacent to the upper portion of the circuitry. Device height may be reduced by having the circuitry be positioned adjacent to one or more of the various header-related structures.

公开(公告)号：US20240261580A1

公开(公告)日：2024-08-08

申请号：US18614666

申请日：2024-03-23

Applicant: Medtronic Inc.

Inventor： Steven Deininger ,  Jeffrey Clayton ,  Michael Baade ,  Anthony Chasensky

IPC: A61N1/375 ,  A61N1/05 ,  A61N1/36

CPC classification number: A61N1/3754 ,  A61N1/36062 ,  A61N1/37514 ,  A61N1/0551 ,  A61N1/36107 ,  A61N1/3756

Abstract: Implantable medical devices include circuitry positioned adjacent to header-related structures, rather than having the header and related structures sitting atop the position of the circuitry within a device housing. A circuit board within the device housing may be positioned adjacently to a lead bore of the header. Feedthrough conductors may extend from the circuitry to conductors of the header while being positioned adjacently to the circuit board. Lead frame conductors may extend to the electrical connectors of the lead bores while also being adjacent to the upper portion of the circuitry. Device height may be reduced by having the circuitry be positioned adjacent to one or more of the various header-related structures.

公开(公告)号：US20210339029A1

公开(公告)日：2021-11-04

申请号：US17372522

申请日：2021-07-12

Applicant: MEDTRONIC, INC.

Inventor： Steven Deininger ,  Jeffrey Clayton ,  Michael Baade ,  Anthony Chasensky

IPC: A61N1/375 ,  A61N1/36 ,  A61N1/05

Abstract: Implantable medical devices include circuitry positioned adjacent to header-related structures, rather than having the header and related structures sitting atop the position of the circuitry within a device housing. A circuit board within the device housing may be positioned adjacently to a lead bore of the header. Feedthrough conductors may extend from the circuitry to conductors of the header while being positioned adjacently to the circuit board. Lead frame conductors may extend to the electrical connectors of the lead bores while also being adjacent to the upper portion of the circuitry. Device height may be reduced by having the circuitry be positioned adjacent to one or more of the various header-related structures.