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公开(公告)号:US11858091B2
公开(公告)日:2024-01-02
申请号:US16723547
申请日:2019-12-20
发明人: Robert Eiseler , Koh Murai , Michael Perkins, II
CPC分类号: B24B57/02 , B01F23/59 , B01F25/51 , B01F35/2113 , B01F35/21112 , B01F2025/931 , B01F2101/58
摘要: An apparatus for recirculating fluids in semiconductor systems. The apparatus including a base portion, an inlet portion coupled to a first end of the base portion, and a nozzle coupled to a second end of the base portion. The nozzle including a helical groove extending from a position near a nozzle base portion to a position near a tip of the nozzle portion. The helical groove extending from an exterior surface through the nozzle portion to an interior surface of the nozzle portion. Methods of using the apparatus in a semiconductor recirculation system are also disclosed.