公开(公告)号：US20240064941A1

公开(公告)日：2024-02-22

申请号：US17892283

申请日：2022-08-22

Applicant: Mellanox Technologies, Ltd.

Inventor： Ran Hasson RUSO ,  Alon RUBINSTEIN ,  Elad MENTOVICH ,  Tahir CADER ,  Siddha GANJU

IPC: H05K7/20 ,  G06N20/00

CPC classification number: H05K7/20836 ,  G06N20/00

Abstract: A system and method for controlling cooling in a server is provided. The method includes receiving one or more server indicators relating to a task to be executed by at least one component of the server. The method also includes determining an expected cooling demand for the at least one component based on the one or more server indicators. The method further includes adjusting a cooling amount provided by a cooling mechanism based on the expected cooling demand of the at least one component. Various embodiments are described herein.

公开(公告)号：US20220276455A1

公开(公告)日：2022-09-01

申请号：US17631655

申请日：2019-08-21

Applicant: Mellanox Technologies, Ltd.

Inventor： Alon RUBINSTEIN ,  Elad MENTOVICH ,  Dimitrios KALAVROUZIOTIS ,  Paraskevas BAKOPOULOS

IPC: G02B6/43 ,  G02B6/42

Abstract: Apparatuses, systems, and associated methods of manufacturing are described that provide an optical interposer and associated communication system. An example optical interposer includes a substrate having a first end that receives a first optical fiber welded thereto and a second end that receives a plurality of photonic integrated circuits (PICs) attached thereto. The interposer further includes an optical waveguide network defined by the substrate that provides optical communication between the first welded optical fiber and the plurality of PICs. The optical waveguide network also includes optical redistribution elements supported by the substrate. In an operational configuration, the optical interposer receives a first input optical signal from the first welded optical fiber, and the plurality of optical redistribution elements successively split the first input optical signal such that a plurality of output optical signals is directed to the plurality of PICs.

公开(公告)号：US20210400817A1

公开(公告)日：2021-12-23

申请号：US16906016

申请日：2020-06-19

Applicant: Mellanox Technologies, Ltd.

Inventor： Boaz ATIAS ,  Alon RUBINSTEIN ,  Elad MENTOVICH ,  Anna SANDOMIRSKY ,  Alexei STRASHKO

IPC: H05K3/14 ,  G01R27/16

Abstract: A method for adjusting the value of the characteristic impedance Zo of a microstrip transmission line printed on an outer layer of a printed circuit board (PCB) comprises performing a post-manufacturing process directly on the artwork of a production PCB.