公开(公告)号：US20250155732A1

公开(公告)日：2025-05-15

申请号：US18936860

申请日：2024-11-04

Applicant: Meta Platforms Technologies, LLC

Inventor： Alex Ockfen ,  Hunter Cantrell

IPC: G02C11/00 ,  G02C5/14 ,  H05K7/20

Abstract: A head-worn device that includes a lens frame, a first temple arm, one or more electrical components, and a heat-transfer component. The lens frame is configured to hold at least two lenses in place. The first temple arm is coupled to the lens frame via a hinge. The one or more electrical components are located within the lens frame, and the one or more electrical components emit heat when operating. The heat-transfer component is configured to transfer the heat from the one or more electrical components to the first temple arm, and the transferring the heat from the one or more electrical components to the first temple arm is configured to cause a lengthening of a time duration during which the one or more electrical components can operate at their respective thermal design power (TDP).

公开(公告)号：US12032171B1

公开(公告)日：2024-07-09

申请号：US17745633

申请日：2022-05-16

Applicant: Meta Platforms Technologies, LLC

Inventor： Michael Nikkhoo ,  Hunter Cantrell ,  Brian Toleno ,  Shobhit Verma ,  Igor Markovsky

IPC: G02B27/01 ,  G06F1/16 ,  G06F1/20 ,  H05K7/20

CPC classification number: G02B27/0176 ,  G06F1/163 ,  G06F1/1681 ,  G06F1/203 ,  H05K7/20436

Abstract: A method and system to conduct thermal energy between two hinged portions of an electric device. In examples, the method employs a thermal hinge system configured to transfer or spread thermal energy, and optionally electrical energy, through a mechanical articulation or hinge in an electronic device. A thermal hinge may include a thermally conductive living hinge, complementary and/or mating thermal interface components, or a combination of both.