公开(公告)号：US20250159319A1

公开(公告)日：2025-05-15

申请号：US18920695

申请日：2024-10-18

Applicant: Meta Platforms Technologies, LLC

Inventor： Samuel Tam

IPC: H04N23/52 ,  H04N23/51 ,  H04N23/57

Abstract: A camera module includes a routing substrate, an image sensor, electrical components, molding compound, and an electro-magnetic interference (EMI) shield layer. The routing substrate has a ground plane coupled between a first side of the routing substrate and a second side of the routing substrate. The image sensor is configured to receive incident image light. The electrical components are electrically coupled to the second side of the routing substrate. The molding compound supports the image sensor and supports the electrical components. The EMI shield layer is disposed on the molding compound and the EMI shield layer is tied to the ground plane of the routing substrate.

公开(公告)号：US20220385796A1

公开(公告)日：2022-12-01

申请号：US17879688

申请日：2022-08-02

Applicant: Meta Platforms Technologies, LLC

Inventor： Samuel Tam ,  Jianer Bao ,  Alexander Hsing ,  Alejandra Alvarez Albarran ,  Jake Fine ,  Dong Rim Lee ,  Arman Boromand ,  Alex Ockfen

IPC: H04N5/225 ,  H01L27/146

Abstract: A camera device for integration into a wearable device is presented. The camera device includes an image sensor, a lens assembly, a first high density interconnect (HDI) tape substrate, a second HDI tape substrate, and a molded plastic layer. The molded plastic layer is sandwiched between the first and second HDI tape substrates. A wearable device with at least one soft electrode is further presented. The at least one soft electrode includes a conductive coating applied to an elastomer substrate and monitors electrical signals generated by a wearer of the wearable device to initiate an appropriate action. A method of forming an aggregate coating for a wearable device is further presented. One or more thin films are applied to a surface of the wearable device, and a paint coating is applied to a surface of the one or more thin films to form the aggregate coating.

公开(公告)号：US20230280637A1

公开(公告)日：2023-09-07

申请号：US18195846

申请日：2023-05-10

Applicant: Meta Platforms Technologies, LLC

Inventor： Vijay Kumar ,  Lidu Huang ,  Samuel Tam

IPC: G03B13/36 ,  H02K41/035 ,  H04N23/50

CPC classification number: G03B13/36 ,  H02K41/0354 ,  H04N23/50 ,  G03B30/00

Abstract: A camera device for integration into an electronic wearable device. The camera device includes a lens assembly, an image sensor, a first actuator assembly, and a second actuator assembly. The first actuator assembly translates the lens assembly over a first range along an optical axis, wherein power consumed by the first actuator assembly increases with a distance the lens assembly is actuated along the optical axis from a neutral position of the lens assembly. The second actuator assembly translates the image sensor over a second range along the optical axis, wherein the second range is smaller than the first range. A method of packaging the camera device is further presented where a molded plastic layer is sandwiched between a first high density interconnect (HDI) tape substrate and a second HDI tape substrate. The molded plastic layer includes vias to interconnect electrodes of the first and second HDI tape substrates.

公开(公告)号：US12149803B1

公开(公告)日：2024-11-19

申请号：US17884837

申请日：2022-08-10

Applicant: Meta Platforms Technologies, LLC

Inventor： Samuel Tam

IPC: H04N23/50 ,  H01R12/59

Abstract: A camera module includes an image sensor die, high-density interconnect (HDI) tape, and a number of passive electronic components. The image sensor die has a first side and a second side. The first side includes a pixel array, and the second side is opposite the first side. The HDI tape is a flexible substrate coupled to the image sensor. The HDI tape is at least partially folded or bent around the image sensor to couple to the HDI tape to the first and second sides of the image sensor die. The passive electronic components are coupled to the second side of the HDI tape and provide rigidity to the camera module.

公开(公告)号：US20240098348A1

公开(公告)日：2024-03-21

申请号：US17870581

申请日：2022-07-21

Applicant: Meta Platforms Technologies, LLC

Inventor： Samuel Tam

IPC: H04N5/225 ,  G02B27/01

CPC classification number: H04N5/2252 ,  G02B27/0172 ,  H04N5/22525 ,  H04N5/2253 ,  G02B2027/0138 ,  G02B2027/0178

Abstract: A camera module includes an image sensor die, high-density interconnect (HDI) tape, and a number of passive electronic components. The image sensor die has a first side and a second side. The first side includes a pixel array, and the second side includes a number of bonding pads. The HDI tape is a flexible substrate coupled to the image sensor. The HDI tape includes a number of traces positioned between a first side and a second side. The first side of the HDI tape is coupled to the second side of the image sensor die. The passive electronic components are coupled to the second side of the HDI tape and provide rigidity to the camera module.