公开(公告)号：US20240340404A1

公开(公告)日：2024-10-10

申请号：US18130593

申请日：2023-04-04

Applicant: Meta Platforms Technologies, LLC

Inventor： Song CHEN ,  Qing Chao ,  Yi Zheng

IPC: H04N13/383 ,  G02B27/01 ,  G06F1/16 ,  H04N13/128 ,  H04N13/207 ,  H04N13/344

CPC classification number: H04N13/383 ,  G02B27/0172 ,  G02B27/0179 ,  G06F1/163 ,  H04N13/128 ,  H04N13/207 ,  H04N13/344 ,  G02B2027/0178 ,  G02B2027/0187 ,  H04N2013/0081

Abstract: A system for three-dimensional object sensing using fringe-projection profilometry with Fourier transform analysis is described. A fringe-projection profilometry (FPP) projector simultaneously transmits a frequency signal pattern (i.e., modulated or AC signal) and a zero-frequency signal pattern (i.e., unmodulated or DC signal) onto an object's surface. Alternatively, the projector projects two frequency signal patterns phase-shifted by 180 degrees. A dual readout sensor captures reflections of both signals from the object's surface as adjacent frames, and the DC signal is extracted by subtraction of addition to obtain an enhanced signal. The enhanced signal is used to generate a wrapped phase map through Fourier transform profilometry (FTP). The resulting wrapped phase map is unwrapped, and three-dimensional reconstruction of the object's surface is generated by converting phase from the unwrapped phase map to three-dimensional coordinates.

公开(公告)号：US20230084614A1

公开(公告)日：2023-03-16

申请号：US17849264

申请日：2022-06-24

Applicant: Meta Platforms Technologies, LLC

Inventor： Song CHEN ,  Xinqiao LIU ,  Byron TAYLOR

IPC: H01L27/146 ,  G02B27/01

Abstract: Methods and systems for image sensing are provided. In one example, an apparatus comprises a semiconductor substrate comprising a light incident surface to receive light, a first pinned photodiode, and a second pinned photodiode, the first pinned photodiode and the second pinned photodiode forming a stack structure in the semiconductor substrate along an axis perpendicular to the light incident surface, the stack structure enabling the first pinned photodiode and the second pinned photodiode to, respectively, convert a first component of the light and a second component of the light to first charge and second charge. The apparatus further comprises one or more capacitors formed in the semiconductor substrate and configured to generate a first voltage and a second voltage based on, respectively, the first charge and the second charge.