公开(公告)号：US12127430B2

公开(公告)日：2024-10-22

申请号：US17589872

申请日：2022-01-31

Applicant: Meta Platforms Technologies, LLC

Inventor： Giti Karimi Moghaddam ,  Douglas Moskowitz ,  Kyung Won Park ,  Ryan Fleming ,  Alexander Klement ,  Donghee Nam ,  Yi-Chen Kuo ,  Mark Shintaro Ando

IPC: H05K1/00 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H05K7/20 ,  H10K50/87

CPC classification number: H10K50/87 ,  H01L25/18 ,  H05K1/0204 ,  H05K1/189 ,  H05K7/20972 ,  H05K7/2099 ,  H05K2201/056 ,  H05K2201/10128 ,  H05K2201/10159 ,  H05K2201/2036

Abstract: A device includes a micro-organic light emitting diode (μ-OLED) display panel and an electronic component. An electrical connector electrically couples the μ-OLED display panel and the electronic component. A standoff is disposed between the electronic component and the μ-OLED display panel. The standoff physically couples the electronic component and the μ-OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the μ-OLED display panel. A U-shaped heat sink can be disposed in the standoff, and heat generated by the μ-OLED display can be mitigated by a system fan when a U-shaped heat sink is disposed in the standoff.

公开(公告)号：US20230041202A1

公开(公告)日：2023-02-09

申请号：US17863266

申请日：2022-07-12

Applicant: Meta Platforms Technologies, LLC

Inventor： Igor Markovsky ,  Johana Gabriela Coyoc Escudero ,  Demetrios Basil Karanikos ,  Brandon Potens ,  Rafat Mehdi ,  Sebastian Sztuk ,  Pablo Castillo Canales ,  Eric Daniels ,  Andriy Pletenetskyy ,  Abhinav Subramani ,  Jaykishan Dakshesh Choksi ,  Katherine Suzi Torigoe ,  Raymond Lee ,  Evan Lawrence Coons ,  Yi-Chen Kuo ,  Kai Tashima McKenney ,  Simon David-Levinskas Hodgson ,  Trevor Grant Boswell ,  Punit Narendra Govenji ,  Nan Wang ,  Melinda Dora Szabo ,  Yewching Chen ,  Afsoon Jamali

IPC: G02B27/01

Abstract: A device including a frame and an eyepiece is provided. The eyepiece includes a front glass, a rear glass, and an active element sandwiched between the front glass and the rear glass. The active layer is electrically activated, via an interconnect, by a flex circuit enclosed between a top portion of the frame and a cap, the flex circuit including a memory and a processor. A method for assembling the above device is also provided.