公开(公告)号：US20240302136A1

公开(公告)日：2024-09-12

申请号：US18590352

申请日：2024-02-28

Applicant: WILCOX INDUSTRIES CORP.

Inventor： James W. Teetzel ,  Gary M. Lemire

IPC: F41G11/00 ,  F41G1/38 ,  G02B23/12 ,  H01R12/65 ,  H05K1/02

CPC classification number: F41G11/003 ,  F41G1/38 ,  G02B23/12 ,  H01R12/65 ,  H05K1/028 ,  H05K2201/056

Abstract: An articulating, modular night vision assembly includes a powered bridge assembly with a center base section and left and right pivoting arms, each detachably receiving a night vision monocular assembly. The night vision monocular assemblies include a weapon hot shoe for mounting to a weapon accessory interface. In a further aspect, a powered bridge assembly is provided.

公开(公告)号：US12021419B2

公开(公告)日：2024-06-25

申请号：US17297057

申请日：2020-01-13

Applicant: Bayerische Motoren Werke Aktiengesellschaft

Inventor： Torsten Franke

IPC: H02K11/00 ,  H02K5/20 ,  H02K11/30 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18

CPC classification number: H02K11/30 ,  H02K5/203 ,  H05K1/028 ,  H05K1/14 ,  H05K1/181 ,  H05K2201/056 ,  H05K2201/1009

Abstract: An electronic module includes a first supporting element, a second supporting element, and a plurality of components arranged on the first supporting element and the second supporting element. The first supporting element and the second supporting element are electrically conductively connected, and the second supporting element forms an intermediate chamber in which the first supporting element is arranged.

公开(公告)号：US20240188229A1

公开(公告)日：2024-06-06

申请号：US18442659

申请日：2024-02-15

Applicant: LG INNOTEK CO., LTD.

Inventor： Hyun Woo RYOU

IPC: H05K3/46 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K3/4691 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H05K1/02 ,  H05K1/0281 ,  H05K1/14 ,  H05K1/147 ,  H05K1/144 ,  H05K3/365 ,  H05K2201/056 ,  H05K2201/09163 ,  H05K2201/10121

Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

公开(公告)号：US11990695B2

公开(公告)日：2024-05-21

申请号：US17662715

申请日：2022-05-10

Applicant: Apple Inc.

Inventor： Sam Mahin Shirazi ,  Eric T. Chiang ,  Matthew Burke ,  Tiexuan Wang ,  Yong Gang Li ,  Henry H. Yang

IPC: H01R12/57 ,  H01R4/02 ,  H01R43/20 ,  H01R13/22 ,  H05K1/14 ,  H05K1/18

CPC classification number: H01R12/57 ,  H01R4/02 ,  H01R43/205 ,  H01R13/22 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10128

Abstract: Electronic assemblies and methods of attaching retention structures are described. The electronic assemblies may include a receiving substrate and a retention structure bonded to the receiving substrate. The retention structure may be patterned to include openings such as slot openings or a fishbone pattern in order to receive a pair of solder joints to bond the retention structure to a top side of the receiving substrate.

公开(公告)号：US11778745B2

公开(公告)日：2023-10-03

申请号：US16896014

申请日：2020-06-08

Applicant: Samsung Display Co., Ltd.

Inventor： Seungjin Lim ,  Chung-Seok Lee

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  G02F1/1345 ,  H10K59/131

CPC classification number: H05K1/147 ,  G02F1/13458 ,  H05K1/111 ,  H05K1/189 ,  G02F1/13452 ,  G02F2202/28 ,  H05K2201/056 ,  H05K2201/10128 ,  H05K2201/10136 ,  H10K59/131

Abstract: A display device includes: a display panel including a plurality of display pads each extending in a first direction and arranged in a second direction crossing the first direction; a main circuit board; and a flexible circuit board including: board pads connected to the display pads; and a floating pattern spaced apart from the board pads, the floating pattern connected to the display panel by an anisotropic conductive film (ACF), wherein at least a portion of the floating pattern does not overlap with the ACF in plan view.

公开(公告)号：US11729933B2

公开(公告)日：2023-08-15

申请号：US17590420

申请日：2022-02-01

Applicant: TTM TECHNOLOGIES NORTH AMERICA, LLC

Inventor： Michael Len ,  Nicholas S. Koop ,  Andrew Kempf ,  Matt Gortner

IPC: H05K5/02 ,  H05K1/14 ,  H05K1/18 ,  H05K5/00 ,  H05K5/06

CPC classification number: H05K5/0247 ,  H05K1/147 ,  H05K1/189 ,  H05K5/0004 ,  H05K5/069 ,  H05K2201/056 ,  H05K2201/2018

Abstract: The disclosure provides a low-cost near-hermetic package, which may a substrate configured to support one or more internal components. The package may also include an enclosure comprising a cavity surrounding the one or more internal components and a first sidewall extending upward from the substrate. The first sidewall may be coupled to the substrate. The package may further include a first flexible circuit comprising conductive traces configured to connect to the one or more internal components. The first flexible circuit may include a first section outside the first sidewall of the enclosure, a second section inside the enclosure, and a third section between the first section and the second section joining to the enclosure and the substrate.

公开(公告)号：US11700694B2

公开(公告)日：2023-07-11

申请号：US17383785

申请日：2021-07-23

Applicant: InnoLux Corporation

Inventor： Chun-Lung Tseng ,  Hsin-Hung Chen

IPC: H05K1/14 ,  H05K1/18 ,  H05K5/00 ,  F21V8/00

CPC classification number: H05K1/189 ,  G02B6/0081 ,  H05K5/0017 ,  H05K2201/056 ,  H05K2201/10128

Abstract: An electronic device is disclosed, which includes: a support unit; a display panel disposed on the support unit; a first circuit board, wherein the support unit is disposed between the display panel and the first circuit board; an electronic component disposed on the first circuit board; and a second circuit board electrically connected to the display panel, wherein the second circuit board includes a first portion and a second portion, and the support unit is disposed between the first portion and a second portion, wherein the first circuit board is electrically connected to the display panel through the second circuit board.

公开(公告)号：US11678099B2

公开(公告)日：2023-06-13

申请号：US17202350

申请日：2021-03-16

Applicant: GN Hearing A/S

Inventor： Emil Holm Knudsen

IPC: H04R1/10 ,  H05K1/14

CPC classification number: H04R1/1025 ,  H04R1/1041 ,  H05K1/147 ,  H05K2201/056 ,  H05K2201/1003 ,  H05K2201/10037

Abstract: Disclosed is a hearing device configured to be worn in an ear of a user. The hearing device is configured to provide an audio signal to the user. The hearing device comprises a circuit assembly. The circuit assembly comprises a printed circuit board assembly. The printed circuit board assembly comprises: a first circuit board; a second circuit board; a third circuit board interconnected with the first circuit board and the second circuit board; and a fourth circuit board. The circuit assembly comprises a battery, wherein the printed circuit board assembly is folded about the battery.

公开(公告)号：US11672079B2

公开(公告)日：2023-06-06

申请号：US17444364

申请日：2021-08-03

Applicant: AT&S (China) Co. Ltd.

Inventor： Nick Xin ,  Mikael Tuominen

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/0277 ,  H05K1/0278 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/118 ,  H05K1/148 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/058

Abstract: A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.

公开(公告)号：US20230171893A1

公开(公告)日：2023-06-01

申请号：US18091973

申请日：2022-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonho LEE ,  Hyunggwang KANG ,  Junhyuk KIM ,  Hyunsuk KIM ,  Sanghyuk PARK ,  Joongyeon CHO ,  Nakhyun CHOI ,  Myunghoon KWAK ,  Yangwook KIM ,  Soyoung LEE ,  Jookwan LEE

IPC: H05K1/14 ,  H05K1/02

CPC classification number: H05K1/147 ,  H05K1/028 ,  H05K2201/056 ,  H05K2201/2027

Abstract: An electronic device is disclosed. The electronic device includes: a flexible printed circuit board configured to connect a first printed circuit board and a second printed circuit board and including a rigid area and a flexible area, and a guide at least partially coupled to the rigid area, and located inside the flexible printed circuit board.