Fin-Last Replacement Metal Gate FinFET
    2.
    发明申请
    Fin-Last Replacement Metal Gate FinFET 有权
    Fin-Last Replacement金属栅极FinFET

    公开(公告)号:US20120313170A1

    公开(公告)日:2012-12-13

    申请号:US13157812

    申请日:2011-06-10

    摘要: FinFET devices and methods for the fabrication thereof are provided. In one aspect, a method for fabricating a FET device includes the following steps. A wafer is provided having an active layer on an insulator. A plurality of fin hardmasks are patterned on the active layer. A dummy gate is placed over a central portion of the fin hardmasks. One or more doping agents are implanted into source and drain regions of the device. A dielectric filler layer is deposited around the dummy gate. The dummy gate is removed to form a trench in the dielectric filler layer. The fin hardmasks are used to etch a plurality of fins in the active layer within the trench. The doping agents are activated. A replacement gate is formed in the trench, wherein the step of activating the doping agents is performed before the step of forming the replacement gate.

    摘要翻译: 提供FinFET器件及其制造方法。 一方面,一种用于制造FET器件的方法包括以下步骤。 提供了在绝缘体上具有有源层的晶片。 在活性层上形成多个散热片硬掩模。 虚拟门放置在散热片硬掩模的中心部分上。 将一种或多种掺杂剂注入到器件的源极和漏极区域中。 介电填料层沉积在虚拟栅极周围。 去除伪栅极以在介电填料层中形成沟槽。 散热片硬掩模用于蚀刻沟槽内的有源层中的多个散热片。 掺杂剂被激活。 在沟槽中形成替换栅极,其中激活掺杂剂的步骤在形成替换栅极的步骤之前进行。