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公开(公告)号:US06911155B2
公开(公告)日:2005-06-28
申请号:US10061836
申请日:2002-01-31
申请人: Michael D. Miller , Michael Hager , Naoto A. Kawamura , Roberto A. Pugliese, Jr. , Ronald L. Enck , Susanne L. Kumpf , Shen Buswell , Mehrgan Khavari
发明人: Michael D. Miller , Michael Hager , Naoto A. Kawamura , Roberto A. Pugliese, Jr. , Ronald L. Enck , Susanne L. Kumpf , Shen Buswell , Mehrgan Khavari
CPC分类号: B41J2/1603 , B41J2/1628 , B41J2/1632
摘要: The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.
摘要翻译: 所描述的实施例涉及在衬底中形成槽的方法和系统。 在一个示例性实施例中,在具有第一和第二相对表面的基板中形成槽。 通过衬底的第一表面干蚀刻第一沟槽。 通过衬底的第二表面产生第二沟槽,其有效地与第一沟槽组合形成槽。 槽的至少一部分完全穿过衬底,并且槽的最大宽度小于或等于衬底厚度的约50%。
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公开(公告)号:US06558969B2
公开(公告)日:2003-05-06
申请号:US10225702
申请日:2002-08-21
IPC分类号: H01L2100
CPC分类号: B41J2/1408 , B41J2/14129 , B41J2202/03
摘要: A fluid-jet printhead has a substrate on which at least one layer defining a fluid chamber for ejecting fluid is applied. The printhead includes an elevation layer disposed on the substrate and aligned with the fluid chamber. The printhead also includes a resistive layer disposed between the elevation layer and the substrate wherein the resistive layer has a smooth planer surface interfacing with the resistive layer.
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公开(公告)号:US06457815B1
公开(公告)日:2002-10-01
申请号:US09772410
申请日:2001-01-29
IPC分类号: B41J205
CPC分类号: B41J2/1408 , B41J2/14129 , B41J2202/03
摘要: A fluid-jet printhead has a substrate on which at least one layer defining a fluid chamber for ejecting fluid is applied. The printhead includes an elevation layer disposed on the substrate and aligned with the fluid chamber. The printhead also includes a resistive layer disposed between the elevation layer and the substrate wherein the resistive layer has a smooth planer surface interfacing with the resistive layer.
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