摘要:
A multiple mode digitization system for a non-destructive inspection instrument which makes use of a multiplexing circuit and a single set of analog to digital converters to efficiently digitize analog test signals from a plurality of inputs. In the preferred embodiment, each of the analog to digital converters in the system is driven with an independent and separate clock signal, allowing for propagation delay compensation among the plurality of test signals as well as interleaved sampling such that custom sampling rates can be used for each input without the need for more than one clock frequency. In an alternate embodiment, phase adjustments on the sampling clocks are used only for interleave sampling, and digital filters are used to provide signal propagation delay compensation.
摘要:
A blending circuit is disclosed to be operable to combine plurality of digital outputs received from an analog to digital conversion system to create a composite digital signal. The analog to digital conversion system receives analog signals originated from multiple but substantially the same source signals, wherein the source signals being scaled to different degrees. A blending circuit deploys a blending factor to combine the digital outputs in a manner which blends and/or adjusts portion of each digital output being used to avoid over-flown portion of the digital outputs and to minimize phase and/or amplitude discontinuity of the composite digital signal.
摘要:
An enhanced wireless eddy current probe is disclosed which has means to wirelessly couple to a non-destructive inspection (NDI) system situated some distance away from an inspection point on a material under inspection. The disclosed enhanced wireless eddy current probe provides means for executing advanced functions necessary for a complex eddy current inspection operation. These functions include, but are not limited to, storing, loading, and executing a predetermined firing sequence on an array of coil elements, probe balancing, probe calibration, and providing bibliographic information specific to said probe to a wirelessly coupled NDI system.
摘要:
A non-destructive inspection (NDI) instrument includes a sensor connection system configured to receive test signals from at least two different types of NDI sensors which are configured to obtain test signals from an object being tested. The sensor connection system has sensor-specific connection circuits and at least one common sensor connection circuit. A data acquisition circuitry is coupled to the sensor connection and has sensor-specific data acquisition circuits and at least one common data acquisition circuit. It is further coupled to a common digital data processor which executes sensor-specific processing modules and at least one common processing module. A common display screen and user interface is coupled to the data processor and enables programs including sensor-specific user interface modules and at least one common user interface module. The sensor types preferably include all of or any combination of an ultrasound sensor, an eddy current sensor and acoustic sensor.
摘要:
An X-ray fluorescence (XRF) instrument comprises a hand-held device housing which holds a radiation emitter configured to emit radiation directed at a test object and a radiation detector housed inside a chamber closed by a sealing window and configured to detect radiation of the test object, caused by the test object being exposed to the emitted radiation. A protective cover mechanism is affixed to the testing device and is configured to have a closed position which covers or blocks access to the sealing window to protect it from being broken or damaged by debris or other obstructions, and an open position which exposes the sealing window to allow the un-obstructed passage of radiation therethrough. The cover mechanism can be implemented variously, including by a pivotally mounted cover plate, an iris mechanism, a fan-like cover and the like. Debris can be detected variously, including by strain sensors, optical detectors and proximity sensors.
摘要:
A device is disclosed for performing non-destructive inspection and testing (NDT/NDI) of an elongated test object, wherein the inspection system includes: a test object conveyor for conveying the test object along a longitudinal conveyance path; a probe assembly including phased-array probes, the probe assembly being configured to induce signals in the test object and sense echoes reflected from the test object; a probe assembly conveyor configured to movably support the probe assembly, to move the probe assembly on a circumferential path about the test object; and a control system coupled to the test object conveyor and to the probe assembly conveyor and configured to allow data acquisition by and from the phased-array probes while, simultaneously, the test object moves along the longitudinal path and the phased-array probes move on the circumferential path. The test system may include phased-array probes of different types to optimize detecting faults or cracks in the test object which extend in different directions.
摘要:
An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly is mountable. A printed circuit board assembly is mounted to the heat transfer band at the mounting points, with a thermally conductive portion forming a thermal path between a heat-producing electronic component of the printed circuit board assembly and the heat transfer band. A thermally conductive gasket between the printed circuit board assembly and the heat transfer band at the mounting points facilitates heat transfer. Opposing first and second enclosure portions seal the respective continuous lateral edges of the heat transfer band against penetration of fluid or debris. It is small, compact, lightweight, rugged and otherwise ergonomic for ease of use and protection from accidental impact caused by, for example, dropping the unit. The reliability of the system is improved because the internal electronic components are protected from moisture, dust, and other liquid or particle contaminants, all while maintaining an internal temperature that is lower than a maximum permissible operating temperature.
摘要:
The invention disclosed herein provides a method and system related to phased array ultrasonic systems to identify faults in individual element on a regular basis. The method and system of the present disclosure are based on a simple approach of calculating energy levels in response signals from each individual element and then identifying any discontinuities or unexpected drops in energy levels sensed during a typical phased array operation.
摘要:
An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly is mountable. A printed circuit board assembly is mounted to the heat transfer band at the mounting points, with a thermally conductive portion forming a thermal path between a heat-producing electronic component of the printed circuit board assembly and the heat transfer band. A thermally conductive gasket between the printed circuit board assembly and the heat transfer band at the mounting points facilitates heat transfer. Opposing first and second enclosure portions seal the respective continuous lateral edges of the heat transfer band against penetration of fluid or debris. It is small, compact, lightweight, rugged and otherwise ergonomic for ease of use and protection from accidental impact caused by, for example, dropping the unit. The reliability of the system is improved because the internal electronic components are protected from moisture, dust, and other liquid or particle contaminants, all while maintaining an internal temperature that is lower than a maximum permissible operating temperature.