公开(公告)号：US4152164A

公开(公告)日：1979-05-01

申请号：US734486

申请日：1976-10-21

申请人： Michael Gulla ,  Charles R. Shipley, Jr. ,  Howard A. MacKay

发明人： Michael Gulla ,  Charles R. Shipley, Jr. ,  Howard A. MacKay

IPC分类号： C23C18/16 ,  C23C18/31 ,  C23C18/40 ,  C23C18/44 ,  C23C18/50 ,  C23C18/52 ,  C23C3/02

CPC分类号： C23C18/1617

摘要： This invention relates to electroless metal deposition and more specifically, to a process where a plating solution is brought to equilibrium and thereafter operated with the concentration of plating reactants and by-products maintained substantially constant. The plating solution treated in accordance with the invention is one having evaporative losses of at least one percent per plating cycle. Following the process, a plating solution can be operated indefinitely and yields a metal plate of uniform quality and predictable properties at any time during use of the solution. The invention avoids the known problems of by-product build-up and variable concentration of reactants typically associated with the use of such solutions.

摘要翻译： 本发明涉及无电金属沉积，更具体地说，涉及一种使电镀液达到平衡并随后以电镀反应物和副产物的浓度保持基本恒定的方式操作的方法。 根据本发明处理的电镀溶液是每个电镀循环具有至少1％的蒸发损失的镀液。 在该过程之后，可以无限期地操作电镀溶液，并且在使用溶液期间的任何时间产生均匀质量的金属板和可预测的性质。 本发明避免了通常与使用这种溶液相关的副产物积聚和反应物的可变浓度的已知问题。