POST PROCESSING OF COMPONENTS THAT ARE LASER PEENED
    3.
    发明申请
    POST PROCESSING OF COMPONENTS THAT ARE LASER PEENED 有权
    后处理激光组件的后处理

    公开(公告)号:US20140041224A1

    公开(公告)日:2014-02-13

    申请号:US13584257

    申请日:2012-08-13

    申请人: David S. Murphy

    发明人: David S. Murphy

    IPC分类号: B23P15/02 B24B1/00

    摘要: A method of post processing a laser peened component to remove a laser remelt layer is proposed. The post processing includes a series of steps including grit blasting, chemical etching and mechanical finishing the component. This will ensure that the mechanical property (i.e., damage tolerance) benefit of laser peening is restored to the surface of the component.

    摘要翻译: 提出了一种后处理激光喷丸组件去除激光重熔层的方法。 后处理包括一系列步骤,包括喷砂,化学蚀刻和机械加工组件。 这将确保激光喷丸处理的机械性能(即损伤公差)恢复到部件的表面。