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公开(公告)号:US20070147979A1
公开(公告)日:2007-06-28
申请号:US11315873
申请日:2005-12-22
申请人: Michael Rice , Jeffrey Hudgens , Charles Carlson , William Weaver , Robert Lowrance , Eric Englhardt , Dean Hruzek , Mario Silvetti , Michael Kuchar , Kirk Katwyk , Van Hoskins , Vinay Shah
发明人: Michael Rice , Jeffrey Hudgens , Charles Carlson , William Weaver , Robert Lowrance , Eric Englhardt , Dean Hruzek , Mario Silvetti , Michael Kuchar , Kirk Katwyk , Van Hoskins , Vinay Shah
IPC分类号: B66C23/00
CPC分类号: H01L21/67178 , H01L21/67173 , H01L21/67276 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68707
摘要: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.
摘要翻译: 一种使用多室处理系统或集群工具处理衬底的方法和设备,其具有增加的系统吞吐量,增加的系统可靠性,改进的器件产量性能,更可重复的晶片处理历史(或晶片历史)以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人,以在保留在处理机架中的各种处理室之间传送衬底,使得可以在衬底上执行期望的处理顺序。 在一个方面,并行处理配置包括两个或更多个机器人组件,其适于在垂直和水平方向上移动,以访问保持在通常相邻定位的处理机架中的各种处理室。 通常,这里描述的各种实施例是有利的,因为每行或一组衬底处理室由两个或更多个机器人来维护,以允许增加的生产量和增加的系统可靠性。 此外,本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒,以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室,处理机架和处理机器人的数量。
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公开(公告)号:US20060182536A1
公开(公告)日:2006-08-17
申请号:US11315984
申请日:2005-12-22
申请人: Mike Rice , Jeffrey Hudgens , Charles Carlson , William Weaver , Robert Lowrance , Eric Englhardt , Dean Hruzek , Dave Silvetti , Michael Kuchar , Kirk Katwyk , Van Hoskins , Vinay Shah
发明人: Mike Rice , Jeffrey Hudgens , Charles Carlson , William Weaver , Robert Lowrance , Eric Englhardt , Dean Hruzek , Dave Silvetti , Michael Kuchar , Kirk Katwyk , Van Hoskins , Vinay Shah
IPC分类号: H01L21/677
CPC分类号: H01L21/68707 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/67742 , H01L21/67745 , Y10S414/135
摘要: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.
摘要翻译: 一种使用多室处理系统或集群工具处理衬底的方法和装置,其具有增加的系统吞吐量,增加的系统可靠性,改进的器件产量性能,更可重复的晶片处理历史(或晶片历史)以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人,以在保留在处理机架中的各种处理室之间传送衬底,使得可以在衬底上执行期望的处理顺序。 在一个方面,并行处理配置包括两个或更多个机器人组件,其适于在垂直和水平方向上移动,以访问保持在通常相邻定位的处理机架中的各种处理室。 通常,这里描述的各种实施例是有利的,因为每行或一组衬底处理室由两个或更多个机器人来维护,以允许增加的生产量和增加的系统可靠性。 此外,本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒,以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室,处理机架和处理机器人的数量。
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公开(公告)号:US20050122504A1
公开(公告)日:2005-06-09
申请号:US10987950
申请日:2004-11-12
申请人: Michael Rice , Eric Englhardt , Robert Lowrance , Martin Elliott , Jeffrey Hudgens , Kirk Katwyk , Amitabh Puri
发明人: Michael Rice , Eric Englhardt , Robert Lowrance , Martin Elliott , Jeffrey Hudgens , Kirk Katwyk , Amitabh Puri
IPC分类号: G03G15/02 , H01L21/677
CPC分类号: H01L21/67775 , H01L21/67769
摘要: A movable portion of a substrate carrier handler is extended into a transport path along which a substrate carrier transport system transports a substrate carrier, respective kinematic coupling events are detected between corresponding interface elements of the movable portion and the substrate carrier, respective signals are generated in response thereto, and an alignment offset between the substrate carrier and the substrate carrier transport system is determined based on the signals. A movable portion matches an elevation, position, and/or a speed/velocity of a substrate carrier moving along the transport path. Sensors for detecting kinematic coupling and generating signals in response thereto are provided on the movable portion. An end effector includes a support with interface elements and sensors for detecting kinematic coupling and generating respective signals. A substrate carrier handler includes a movable portion, interface elements, sensors, and a controller for receiving signals and determining an alignment offset.
摘要翻译: 衬底载体处理器的可移动部分延伸到传送路径中,衬底载体传输系统沿着传送路径传送衬底载体,在可移动部分的对应界面元件和衬底载体之间检测到相应的运动耦合事件, 基于这些信号来确定衬底载体和衬底载体传输系统之间的对准偏移。 可移动部分匹配沿着传送路径移动的衬底载体的高度,位置和/或速度/速度。 用于检测运动耦合和响应于此产生信号的传感器设置在可动部分上。 端部执行器包括具有接口元件的支撑件和用于检测运动耦合并产生相应信号的传感器。 基板载体处理器包括可移动部分,接口元件,传感器和用于接收信号并确定对准偏移的控制器。
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公开(公告)号:US20050186063A1
公开(公告)日:2005-08-25
申请号:US10987956
申请日:2004-11-12
申请人: Michael Rice , Eric Englhardt , Robert Lowrance , Martin Elliott , Jeffrey Hudgens , Kirk Katwyk , Amit Puri
发明人: Michael Rice , Eric Englhardt , Robert Lowrance , Martin Elliott , Jeffrey Hudgens , Kirk Katwyk , Amit Puri
CPC分类号: H01L21/67769 , H01L21/67253 , H01L21/67276
摘要: In a first aspect, a first method of calibrating a substrate carrier loader to a moving conveyor is provided. The first method includes the steps of (1) providing a substrate carrier loader adapted to load substrate carriers onto a moving conveyor; (2) aligning the substrate carrier loader to the moving conveyor; and (3) calibrating the substrate carrier loader to the moving conveyor. Numerous other aspects are provided.
摘要翻译: 在第一方面,提供了一种将基板载体加载器校准到移动输送机的第一种方法。 第一种方法包括以下步骤:(1)提供适于将基板载体加载到移动输送机上的基底载体加载器; (2)将基板载体装载器对准移动的输送机; 和(3)将衬底载体装载器校准到移动的输送机。 提供了许多其他方面。
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