摘要:
Circuitry and method for collecting image array data in which pixels are addressed and dynamically clamped separately. In accordance with one embodiment, pixels are addressed and clamped during different time intervals, thereby allowing faster pixel data readout while still allowing sufficient time to remove all pixel charges.
摘要:
A method for determining parameters of a beam is disclosed. As a part of a disclosed method, a beam is received at an image detection array where charges are generated and collected, at a plurality of pixels. Values associated with at least one of a plurality of parameters of the beam are determined by integrating information supplied from each of the pixels. Feedback is generated that represents the values.
摘要:
A multi-layered mega-voltage digital imager is disclosed. In one embodiment, the radiation to particle conversion and particle to electricity conversion is paired as a modular entity. The entity is replicated on top of each other as a layered unit to build an imager with increased resolution and efficiency. Due to this paired replication, sub-images from each replicated pair may be selectively combined and processed to enhance the quality of the image. By varying and adding components at each layer, a different dose rate, and increased resolution, energy sensitivity and efficiency are achieved. The multilayered approach is cost effective and removes problems associated with traditional high efficient MV imagers used for high energy radiations.
摘要:
The claimed subject matter describes a novel technique to measure the beam profile using an area detector. In one embodiment, a set of one-dimensional beam profile measurements is performed by taking two images under the same source conditions but at two different positions of the detector, with each position of the detector shifted by a certain distance in the direction corresponding to the direction of the one-dimensional profile measurement. In further embodiments, a set of two-dimensional beam profile measurements is achieved by determining a second set of one-dimensional profiles from the same sampling points in a second direction and building a two-dimensional map of the beam profile by correlating the first one-dimensional profile measurement with the second one-dimensional profile measurement.