公开(公告)号：US07061949B1

公开(公告)日：2006-06-13

申请号：US10640972

申请日：2003-08-13

申请人： Michael Zhou ,  Die-Chi Sun ,  Kee-Sin Tan ,  Wenbin Jiang

发明人： Michael Zhou ,  Die-Chi Sun ,  Kee-Sin Tan ,  Wenbin Jiang

IPC分类号： H01S3/04

CPC分类号： H01S5/02296 ,  H01L2224/48137 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02212 ,  H01S5/02284 ,  H01S5/0683 ,  H01L2924/00

摘要： Semiconductor packaging methods, systems and apparatus for semiconductor lasers to achieve high modulation bandwidth. Systems, methods and apparatus for minimizing the inductance of wire bond interconnects and impedance matching in a semiconductor laser package. Systems, methods and apparatus for monitoring a photocurrent in order to provide automatic power control (APC) of a semiconductor laser.

摘要翻译： 用于半导体激光器的半导体封装方法，系统和装置，以实现高调制带宽。 用于最小化引线键合互连的电感和半导体激光器封装中的阻抗匹配的系统，方法和装置。 用于监测光电流的系统，方法和装置，以提供半导体激光器的自动功率控制（APC）。

公开(公告)号：US20060192221A1

公开(公告)日：2006-08-31

申请号：US11409938

申请日：2006-04-24

申请人： Michael Zhou ,  Die-Chi Sun ,  Kee-Sin Tan ,  Wenbin Jiang

发明人： Michael Zhou ,  Die-Chi Sun ,  Kee-Sin Tan ,  Wenbin Jiang

IPC分类号： H01S3/04 ,  H01L33/00 ,  H01L31/12 ,  H01L29/22

CPC分类号： H01S5/02296 ,  H01L2224/48137 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02212 ,  H01S5/02284 ,  H01S5/0683 ,  H01L2924/00

摘要： Semiconductor packaging methods, systems and apparatus for semiconductor lasers to achieve high modulation bandwidth. Systems, methods and apparatus for minimizing the inductance of wire bond interconnects and impedance matching in a semiconductor laser package. Systems, methods and apparatus for monitoring a photocurrent in order to provide automatic power control (APC) of a semiconductor laser.

公开(公告)号：US06851867B2

公开(公告)日：2005-02-08

申请号：US10452473

申请日：2003-05-30

申请人： Ron Cheng Chuan Pang ,  Kee-Sin Tan ,  Kah Yuan Phang

发明人： Ron Cheng Chuan Pang ,  Kee-Sin Tan ,  Kah Yuan Phang

IPC分类号： G02B6/38 ,  G02B6/42 ,  H01R13/46 ,  G02B6/36 ,  G02B6/00

CPC分类号： G02B6/4261 ,  G02B6/3897 ,  G02B6/4246 ,  G02B6/4292

摘要： A cam-follower release mechanism for fiber optic modules with side releases. The cam-follower release mechanism translates rotational motion into linear motion. The release mechanism has a rotatable bail lever with a cam lobe that pivots about a pivot point and presses against a bearing surface of the fiber optic module. The release mechanism further has a base with a pin about with the rotatable bail lever may pivot and a sliding fork with sliding side actuators and delatch actuators at each end. As a follower, the base and sliding fork is linearly pulled as the rotatable bail lever is rotated. As the sliding fork is pulled out, the delatch actuators at each end push in on side tabs of a cage into which the fiber optic module may be inserted. The release mechanism further has a spring to apply a force against the rotation of the rotatable bail lever to return it to home and retain the release mechanism moveable coupled to the fiber optic module. The fiber optic module further includes opto-electronic devices mounted to a printed circuit board, and a housing.

摘要翻译： 具有侧面释放功能的光纤模块的凸轮从动释放机构。 凸轮从动件释放机构将旋转运动转换为直线运动。 释放机构具有可旋转的吊环杠杆，其具有凸轮凸角，所述凸轮凸角围绕枢转点枢转并且压靠光纤模块的支承表面。 释放机构还具有带销的底座，可旋转的吊环杠杆可以枢转，并且每个端部具有滑动侧致动器和分段致动器的滑动叉。 作为跟随者，当可旋转吊环杆旋转时，基座和滑动叉线性地被拉直。 当滑动叉被拉出时，每个端部的脱钩致动器推入可以插入光纤模块的笼的侧突出部。 释放机构还具有弹簧以施加抵抗可旋转吊环杠杆的旋转的力使其返回到原位并且保持可移动地联接到光纤模块的释放机构。 光纤模块还包括安装到印刷电路板的光电装置和壳体。