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公开(公告)号:US07222326B2
公开(公告)日:2007-05-22
申请号:US10709130
申请日:2004-04-15
IPC分类号: G06F17/50
CPC分类号: G05B19/4183 , G05B2219/32129 , G05B2219/35032 , G05B2219/45031 , H01L21/78 , Y02P90/10 , Y02P90/265
摘要: A method, system and program product for generating a process aid on a wafer are disclosed. A “process aid” can be any device provided on a wafer that assists in some process step, but does not ultimately make up part of a usable die. The invention implements libraries of technology design rules, and process aid parameters, and a process aid instruction file library to allow automatic generation of a process aid according to the technology design rules and parameters. As a result, all the inputs required to build a process aid are available up front, which allows the invention to automatically adjust kerf designs to conform to the new technologies. In addition, the invention provides documentation indicating the inputs and details of the process aid produced.
摘要翻译: 公开了一种用于在晶片上产生加工助剂的方法,系统和程序产品。 “加工助剂”可以是提供在晶片上的任何装置,其有助于一些工艺步骤,但是最终不能构成可用的模具的一部分。 本发明实现了技术设计规则库和处理辅助参数,以及一个可以根据技术设计规则和参数自动生成过程辅助的过程辅助指令文件库。 因此,建立加工助剂所需的所有投入都可以在前面获得,这使得本发明可以自动调整切口设计以符合新技术。 此外,本发明提供了指出所生产的加工助剂的输入和细节的文件。