SUBSTRATE COVER AND CHARGED PARTICLE BEAM WRITING METHOD USING SAME
    1.
    发明申请
    SUBSTRATE COVER AND CHARGED PARTICLE BEAM WRITING METHOD USING SAME 失效
    基板封装和使用相同的充电颗粒光束写入方法

    公开(公告)号:US20110155930A1

    公开(公告)日:2011-06-30

    申请号:US12970084

    申请日:2010-12-16

    IPC分类号: G21K5/10

    摘要: A substrate cover 40 includes a conductive portion 41 having a shape corresponding to a peripheral edge region of a substrate. Since at least part of the conductive portion includes transmissive portions 47 each formed of a light transmissive member, it is configured so as to allow desired light to penetrate through. The position of each edge portion of the substrate is detected in such a manner that the substrate is disposed with the substrate cover 40 placed thereon between light irradiation means and a light detecting unit, irradiation light directed from the light irradiation means located above the substrate to the edge portion of the substrate is made to penetrate through at least part of the substrate cover 40, the edge portion of the substrate is then irradiated with light from the irradiation means.

    摘要翻译: 基板盖40包括具有与基板的周缘区域对应的形状的导电部41。 由于导电部分的至少一部分包括由透光构件形成的透射部分47,所以它被构造成允许期望的光穿透。 以这样的方式检测基板的每个边缘部分的位置,使得基板设置在其上放置有光照射装置和光检测单元之间的基板盖40,从位于基板上方的光照射装置引导的照射光 使基板的边缘部分穿过基板盖40的至少一部分,然后用来自照射装置的光照射基板的边缘部分。