公开(公告)号：US5886457A

公开(公告)日：1999-03-23

申请号：US921859

申请日：1997-08-25

申请人： Michinobu Maesaka ,  Jyunji Oyama ,  Makoto Irie ,  Atsushi Hirakawa

发明人： Michinobu Maesaka ,  Jyunji Oyama ,  Makoto Irie ,  Atsushi Hirakawa

IPC分类号： H01L23/10 ,  H03H3/02 ,  H03H9/10 ,  H03H9/17 ,  H01L41/08

CPC分类号： H01L23/10 ,  H01L2924/09701 ,  H01L2924/16152

摘要： A sealing structure and a sealing method for an electronic component achieves desired sealing properties and heat resistance. An electronic component element is mounted on a substrate having an electrode pattern disposed thereon, and is sealed by bonding a cap for covering the electronic component element on the substrate. An adhesive structure used to join the cap on the substrate includes a high-glass-transition-point adhesive partially coated on the cap bonded portion of the substrate, and a low-glass-transition-point adhesive coated over an entire periphery of the opening of the cap. The opening of the cap is pressed on a mounting portion of the substrate, and the adhesives are then cured to bond and seal the substrate and the cap.

公开(公告)号：US6048433A

公开(公告)日：2000-04-11

申请号：US145765

申请日：1998-09-02

申请人： Michinobu Maesaka ,  Jyunji Oyama ,  Makoto Irie ,  Atsushi Hirakawa

发明人： Michinobu Maesaka ,  Jyunji Oyama ,  Makoto Irie ,  Atsushi Hirakawa

IPC分类号： H01L23/10 ,  H03H3/02 ,  H03H9/10 ,  H03H9/17 ,  H01L21/02

CPC分类号： H01L23/10 ,  H01L2924/09701 ,  H01L2924/16152

摘要： A sealing structure and a sealing method for an electronic component achieves desired sealing properties and heat resistance. An electronic component element is mounted on a substrate having an electrode pattern disposed thereon, and is sealed by bonding a cap for covering the electronic component element on the substrate. An adhesive structure used to join the cap on the substrate includes a high-glass-transition-point adhesive partially coated on the cap bonded portion of the substrate, and a low-glass-transition-point adhesive coated over an entire periphery of the opening of the cap. The opening of the cap is pressed on a mounting portion of the substrate, and the adhesives are then cured to bond and seal the substrate and the cap.

摘要翻译： 电子部件的密封结构和密封方法具有期望的密封性和耐热性。 电子元件安装在其上设置有电极图案的基板上，并且通过将用于覆盖电子元件的盖覆盖在基板上而被密封。 用于将盖连接在基板上的粘合剂结构包括部分涂覆在基板的盖接合部分上的高玻璃 - 过渡点粘合剂和涂覆在开口的整个外周上的低玻璃 - 转变点粘合剂 的帽子。 盖的开口被压在基板的安装部分上，然后将粘合剂固化以粘结和密封基板和盖。

公开(公告)号：US06500483B1

公开(公告)日：2002-12-31

申请号：US09512508

申请日：2000-02-24

申请人： Masato Higuchi ,  Atsushi Hirakawa ,  Michinobu Maesaka

发明人： Masato Higuchi ,  Atsushi Hirakawa ,  Michinobu Maesaka

IPC分类号： B05D512

CPC分类号： H01L21/50 ,  Y10T156/1798

摘要： A method for applying a sealant to a component, in which the sealant is applied to a part of or the entirety of a sealing surface of the component, comprises the steps of: disposing in the sealant, an abutting member approximately in parallel to a surface of the sealant, which is a liquid, formed into a film of a specified thickness; pressing the sealing surface of the component to the abutting member in the sealant formed into the film; and transferring the sealant to the sealing surface of the component by pulling the component apart from the sealant.

摘要翻译： 将密封剂施加到部件的密封面的一部分或整体的部件上施加密封剂的方法包括以下步骤：在密封剂中设置大致平行于表面的抵接构件 的密封剂，其是液体，形成为特定厚度的膜; 将所述部件的密封面压在形成所述膜的密封剂中的抵接部件上; 并且通过将部件从密封剂中分离而将密封剂转移到部件的密封表面。

公开(公告)号：US06437412B1

公开(公告)日：2002-08-20

申请号：US09592517

申请日：2000-06-12

申请人： Masato Higuchi ,  Atsushi Hirakawa ,  Shinobu Uesugi ,  Koichi Kanryo

发明人： Masato Higuchi ,  Atsushi Hirakawa ,  Shinobu Uesugi ,  Koichi Kanryo

IPC分类号： H03H925

CPC分类号： H03H9/1071 ,  H01L2224/48091 ,  H01L2924/16195 ,  H01L2924/00014

摘要： A surface acoustic wave device includes a surface acoustic wave element and a package. The package has a base member and a conductive cap member which are joined together by a sealing material so as to hermetically seal the surface acoustic wave element therein. The conductive cap member is coated with the sealing material on the entire surface thereof that is disposed opposite to the base member.

摘要翻译： 表面声波装置包括表面声波元件和封装。 该封装具有通过密封材料接合在一起的基部构件和导电盖构件，以便将表面声波元件气密地密封。 导电盖构件在与基座构件相对设置的整个表面上涂覆有密封材料。