摘要:
A liquid crystal aligning agent, which contains (1) at least one polymer selected from a polyamic acid and an imidized polymer therefrom; (2) at least one first solvent selected from the group consisting of N-alkyl-2-pyrrolidones, lactones and 1,3-dialkyl-2-imidazolidinones; (3) at least one second solvent from (a) a phenyl ether solvent of the formula (I): ##STR1## and (b) an ester ether solvent of the formula (II) ##STR2## wherein R.sup.1 -R.sup.6, a, b and c are as defined herein.
摘要:
A liquid crystal-aligning agent comprising at least one of a polyamic acid obtained by reacting (A) a tetracarboxylic acid dianhydride consisting of 70 to 98 mole % of a dianhydride of a tetracarboxylic acid such as ##STR1## or the like, and 2 to 30 mole % of a dianhydride of a cyclobutanetetracarboxylic acid, and (B) a diamine compound, and a polymer obtained by imidizing the polyamic acid.
摘要:
A liquid crystal alignment agent containing at least two kinds of polymers selected from the group consisting of polyamic acids and imidized polymers and having a structure obtained by dehydration and ring closure of polyamic acid. In the at least two kinds of polymers contained in the liquid crystal alignment agent, the polymer of higher imidization degree has a smaller surface free energy. The liquid crystal alignment agent gives a liquid crystal display device having less stuck image and high pretilt angle.
摘要:
There are provided a polyamic acid obtainable by reacting a diamine compound of the formula (1) ##STR1## wherein R.sup.1 is an alkyl group having 1 to 12 carbon atoms, a haloalkyl group having 1 to 12 carbon atoms or a halogen atom, each of X and Y is independently a divalent linking group, with a tetracarboxylic acid dianhydride; a polyimide obtainable by dehydrating and ring-closing the above polyamic acid; and a liquid crystal aligning agent containing the above polyamic acid and/or the above polyimide.
摘要:
A process for producing a polybutadiene rubber having a cis-1,4 content of 94% or more, a ratio of weight average molecular weight to number average molecular weight of 2.5 to 3.5 as measured by a gel permeation chromatography and a Mooney viscosity (ML.sub.1+4, 100.degree. C.) of 20 to 100, which process comprises polymerizing 1,3-butadiene in an inert organic solvent with a catalyst comprising as the main components (a) a nickel compound; (b) a specific fluorine compound; (c) a trialkylaluminum; and (d) a halogenated aldehyde and/or a quinone compound. The use of the specific catalyst enables the production in a high yield of a polybutadiene rubber which maintains the abrasion resistance, high impact resilience and low heat buildup which are the characteristics of polybutadiene rubber and has a small die swell when extruded in the form of a blend with a natural rubber and is excellent in physical properties of vulcanizate.
摘要:
It is an object of the present invention to provide a novel photo-curing composition which can be cured by light of a wide wavelength region including ultraviolet light or visible light, has such high sensitivity that it can be sufficiently cured by exposure to a small amount of light, can favorably form a fine pattern when used as a resist and provides a cured product having excellent heat resistance and insulating properties, and a negative photoresist composition using the photo-curing composition. It is another object of the present invention to provide a process for highly accurately and easily producing a polyimide thin film used for a medical instrument, and a medical instrument having the polyimide thin film. The photo-curing composition of the present invention comprises (A) a carbon cluster and/or its derivative, having a photosensitizing function, (B) a compound having plural heterocyclic rings in a molecule, and if necessary, (C) a photo-insensitive resin.
摘要:
[Problem] To provide an adhesive composition which is used for fixing a semiconductor wafer or the like onto a substrate, exhibits firm adhesion with high heat resistance in the wafer grinding stage and is melted by heating to enable easy peeling after the completion of the wafer grinding stage. [Means to solve problem] The hot-melt adhesive composition of the invention is a composition containing as a main component a crystalline compound having a melting temperature of 50 to 300° C., and has a melting temperature width of not more than 30° C. and a melt viscosity of not more than 0.1 Pa·s. The crystalline compound as a main component is desired to be an organic compound composed of elements of C, H and O only and having a molecular weight of not more than 1000, preferably an aliphatic compound or an alicyclic compound, particularly preferably a compound having a steroid skeleton and/or a hydroxyl group.