公开(公告)号：US20130034926A1

公开(公告)日：2013-02-07

申请号：US13649367

申请日：2012-10-11

Applicant: MicroLink Devices, Inc.

Inventor： Raymond CHAN ,  Christopher YOUTSEY

IPC: H01L31/18

CPC classification number: H01L31/0504 ,  H01L31/0508 ,  Y02E10/50

Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.

Abstract translation: 提供了组装太阳能电池阵列的装配技术。 在制造太阳能电池期间，通过半导体层的开口被蚀刻到背面金属层的顶表面。 太阳能电池包括背面金属层的暴露的顶表面。 多个太阳能电池被组装成太阳能电池阵列，其中相邻电池单独地以电串联或并联的方式从太阳能电池的顶表面互连。

公开(公告)号：US20130037078A1

公开(公告)日：2013-02-14

申请号：US13649355

申请日：2012-10-11

Applicant: MICROLINK DEVICES, INC.

Inventor： Raymond CHAN ,  Christopher YOUTSEY

IPC: H01L31/05

CPC classification number: H01L31/0504 ,  H01L31/0508 ,  Y02E10/50

Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.