公开(公告)号：US20130037078A1

公开(公告)日：2013-02-14

申请号：US13649355

申请日：2012-10-11

Applicant: MICROLINK DEVICES, INC.

Inventor： Raymond CHAN ,  Christopher YOUTSEY

IPC: H01L31/05

CPC classification number: H01L31/0504 ,  H01L31/0508 ,  Y02E10/50

Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.

公开(公告)号：US20140004645A1

公开(公告)日：2014-01-02

申请号：US13931463

申请日：2013-06-28

Applicant: MicroLink Devices, Inc.

Inventor： Raymond CHAN ,  Haruki MIYAMOTO

IPC: H01L31/18

CPC classification number: H01L31/1876 ,  H01L31/0508 ,  Y02E10/50 ,  Y02P70/521

Abstract: The method of the invention includes the sequential steps of providing a plurality of solar cells, interconnecting the solar cells using one or more interconnect tabs, attaching the interconnect tabs to a top side of the solar cell to interconnect the plurality of solar cells by coupling an exposed top surface of a first solar cell to a top surface of an adjacent second solar cell, attaching one or more bypass diodes to a top side of the solar cell, then next applying an adhesive to a first film layer, placing the plurality of solar cells onto the first film layer, then next applying an adhesive to a second film layer, placing the plurality of solar cells and first film layer onto the second film layer to form a sheet assembly, and then forming the solar sheet from the sheet assembly.

Abstract translation: 本发明的方法包括提供多个太阳能电池的顺序步骤，使用一个或多个互连接片互连太阳能电池，将互连接片连接到太阳能电池的顶侧，以通过将多个太阳能电池联接 将第一太阳能电池的暴露的顶表面暴露于相邻的第二太阳能电池的顶表面，将一个或多个旁路二极管附接到太阳能电池的顶侧，然后将粘合剂施加到第一膜层，将多个太阳能 将电池放置在第一膜层上，然后接着将粘合剂施加到第二膜层，将多个太阳能电池和第一膜层放置在第二膜层上以形成片组件，然后从片组件形成太阳能片。

公开(公告)号：US20130034926A1

公开(公告)日：2013-02-07

申请号：US13649367

申请日：2012-10-11

Applicant: MicroLink Devices, Inc.

Inventor： Raymond CHAN ,  Christopher YOUTSEY

IPC: H01L31/18

CPC classification number: H01L31/0504 ,  H01L31/0508 ,  Y02E10/50

Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.

Abstract translation: 提供了组装太阳能电池阵列的装配技术。 在制造太阳能电池期间，通过半导体层的开口被蚀刻到背面金属层的顶表面。 太阳能电池包括背面金属层的暴露的顶表面。 多个太阳能电池被组装成太阳能电池阵列，其中相邻电池单独地以电串联或并联的方式从太阳能电池的顶表面互连。