公开(公告)号：US20240238110A1

公开(公告)日：2024-07-18

申请号：US18561684

申请日：2022-05-18

Applicant: MicroVention, Inc.

Inventor： Dieter Rutzen ,  Ponaka Pung ,  Shameem Golshan ,  Helen Nguyen ,  Oanh Nguyen ,  Britney Ngo ,  Minh Nguyen ,  Marcus Kraus ,  Nazanin Nourani

IPC: A61F2/852 ,  A61F2/82 ,  A61F2/848 ,  A61F2/90 ,  A61L31/02 ,  A61L31/18

CPC classification number: A61F2/852 ,  A61F2/848 ,  A61F2/90 ,  A61L31/022 ,  A61L31/18 ,  A61F2002/828

Abstract: A vascular implant may comprise at least a first layer having one or more drawn fill tube wires (DFT wires) and at least a second layer having one or more non-DFT wires. The first layer may be braided from only a single DFT wire, and the second layer may be braided from a plurality of non-DFT wire. A vascular implant may also include a connecting wire composed of a shape memory alloy and that is shape set prior to connection to one or more implant layers composed of DFT wires.