公开(公告)号：US20190221502A1

公开(公告)日：2019-07-18

申请号：US15939586

申请日：2018-03-29

Applicant: Microchip Technology Incorporated

Inventor： Joseph Fernandez ,  Rangsun Kitnarong ,  Tarapong Soontornvipart ,  Janwit Apirukaramwong ,  Prachit Punyapor ,  Supakrits Suttiwat ,  Ekgachai Kenganantanon

IPC: H01L23/495

CPC classification number: H01L23/4952 ,  H01L23/49503 ,  H01L23/49575

Abstract: An apparatus includes a lead frame paddle configured for mounting a semiconductor die. The apparatus further includes a plating area formed on the lead frame paddle. The plating area is configured to receive a down bond from a semiconductor die placed on the lead frame paddle. The apparatus further includes an exposed gap between an outer edge of the plating area and an outer edge of the lead frame paddle.