公开(公告)号：US11996815B2

公开(公告)日：2024-05-28

申请号：US17456432

申请日：2021-11-24

Applicant: Microchip Technology Incorporated

Inventor： Steven Vida ,  David Gammie

IPC: H03H11/28

CPC classification number: H03H11/28

Abstract: Disclosed examples include an apparatus. The apparatus may include a differential signal path portion, a first circuit, and a second circuit. The first circuit may be arranged at the differential signal path portion to set a differential impedance of the differential signal path portion. The second circuit may be arranged outside of the differential signal path portion to set a common-mode impedance of the differential signal path portion lower than the differential impedance.

公开(公告)号：US20220166411A1

公开(公告)日：2022-05-26

申请号：US17456432

申请日：2021-11-24

Applicant: Microchip Technology Incorporated

Inventor： Steven Vida ,  David Gammie

IPC: H03H11/28

Abstract: Disclosed examples include an apparatus. The apparatus may include a differential signal path portion, a first circuit, and a second circuit. The first circuit may be arranged at the differential signal path portion to set a differential impedance of the differential signal path portion. The second circuit may be arranged outside of the differential signal path portion to set a common-mode impedance of the differential signal path portion lower than the differential impedance.