公开(公告)号：US10953641B2

公开(公告)日：2021-03-23

申请号：US15928994

申请日：2018-03-22

申请人： Microcosm Technology Co., Ltd

发明人： Tang-Chieh Huang ,  Po-Cheng Chen

IPC分类号： B32B27/28 ,  C08K3/38 ,  C08K3/28 ,  C08K3/36 ,  B32B15/08 ,  C08L79/08 ,  H05K1/03

摘要： A thermally conductive type polyimide substrate is provided. The substrate comprises at least one insulating layer having a metal layer on a single side or both sides thereof. The material of the insulating layer is a thermally conductive type photosensitive resin having a thermal conductivity of 0.4 to 2, and the thermally conductive type photosensitive resin includes the following components: (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a silica solution. The photosensitive polyimide accounts for 50 to 70% of a total weight of a solid composition of the thermally conductive type photosensitive resin. The inorganic filler accounts for 20-30% of the total weight of the solid composition of the thermally conductive type photosensitive resin, and has a particle size between 40 nm and 5 μm. The silica solution comprises silica particles polymerized by a sol-gel process, and the silica particles have a particle size between 10 nm and 15 nm and account for 5 to 30% of the total weight of the solid composition of the thermally conductive type photosensitive resin.

公开(公告)号：US20190002641A1

公开(公告)日：2019-01-03

申请号：US15928994

申请日：2018-03-22

申请人： Microcosm Technology Co., Ltd

发明人： Tang-Chieh Huang ,  Po-Cheng Chen

IPC分类号： C08G73/10 ,  C08K3/38 ,  C08K3/28 ,  C08J7/04 ,  C08J5/24

摘要： A thermally conductive type polyimide substrate is provided. The substrate comprises at least one insulating layer having a metal layer on a single side or both sides thereof. The material of the insulating layer is a thermally conductive type photosensitive resin having a thermal conductivity of 0.4 to 2, and the thermally conductive type photosensitive resin includes the following components: (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a silica solution. The photosensitive polyimide accounts for 50 to 70% of a total weight of a solid composition of the thermally conductive type photosensitive resin. The inorganic filler accounts for 20-30% of the total weight of the solid composition of the thermally conductive type photosensitive resin, and has a particle size between 40 nm and 5 μm. The silica solution comprises silica particles polymerized by a sol-gel process, and the silica particles have a particle size between 10 nm and 15 nm and account for 5 to 30% of the total weight of the solid composition of the thermally conductive type photosensitive resin.