公开(公告)号：US20250149416A1

公开(公告)日：2025-05-08

申请号：US18920479

申请日：2024-10-18

Applicant: Micron Technology, Inc.

Inventor： Faxing Che ,  Amirul Afiq Bin Hud ,  Darren Tan Hong Suang ,  Hong Wang Ng ,  Soon Sing Ng ,  Chin Hui Chong

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/66 ,  H01L23/00 ,  H01L23/552 ,  H01L25/00 ,  H01L25/065

Abstract: A semiconductor device assembly is provided. The assembly includes a substrate and a semiconductor device. The substrate includes a first conductive layer, the first conductive layer having a first trace with a first exposed pad and a second trace with a second exposed pad. A wire bond runs above the first conductive layer to connect the first exposed pad to the second exposed pad, such that the first trace and the second trace are only connected via the wire bond. The semiconductor device includes an electrical connection to the first trace.