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公开(公告)号：US20180006087A1
公开(公告)日：2018-01-04
申请号：US15691576
申请日：2017-08-30
Applicant: Micron Technology, Inc.
Inventor： Antonino Rigano , Fabio Pellizzer , Gianfranco Capetti
CPC classification number: H01L27/2436 , H01L27/101 , H01L27/2463 , H01L45/06 , H01L45/1233
Abstract: Embodiments disclosed herein may relate to forming a base contact layout in a memory device.
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