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Patent Agency Ranking
公开(公告)号：US10037926B2
公开(公告)日：2018-07-31
申请号：US15131635
申请日：2016-04-18
Applicant: Micron Technology, Inc.
Inventor： Ebrahim H Hargan , Layne Bunker , Dragos Dimitriu , Gregory A. King
CPC classification number: H01L22/32 , G01R31/2853 , G01R31/2894 , G11C29/02 , G11C29/022 , G11C29/025 , G11C29/816 , G11C2029/5006 , H01L22/14 , H01L22/22 , H01L25/0657 , H01L2225/06544 , H01L2924/014
Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.
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公开(公告)号：US20160233136A1
公开(公告)日：2016-08-11
申请号：US15131635
申请日：2016-04-18
Applicant: Micron Technology, Inc.
Inventor： Ebrahim H. Hargan , Layne Bunker , Dragos Dimitriu , Gregory A. King
IPC: H01L21/66 , G01R31/28 , H01L25/065
CPC classification number: H01L22/32 , G01R31/2853 , G01R31/2894 , G11C29/02 , G11C29/022 , G11C29/025 , G11C29/816 , G11C2029/5006 , H01L22/14 , H01L22/22 , H01L25/0657 , H01L2225/06544 , H01L2924/014
Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.
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公开(公告)号：US20190109057A1
公开(公告)日：2019-04-11
申请号：US16029199
申请日：2018-07-06
Applicant: Micron Technology, Inc.
Inventor： Ebrahim H. Hargan , Layne Bunker , Dragos Dimitriu , Gregory A. King
IPC: H01L21/66 , H01L25/065 , G01R31/28
Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.
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公开(公告)号：US20150008953A1
公开(公告)日：2015-01-08
申请号：US14494147
申请日：2014-09-23
Applicant: Micron Technology, Inc.
Inventor： Ebrahim H. Hargan , Layne Bunker , Dragos Dimitriu , Gregory A. King
CPC classification number: H01L22/32 , G01R31/2853 , G01R31/2894 , G11C29/02 , G11C29/022 , G11C29/025 , G11C29/816 , G11C2029/5006 , H01L22/14 , H01L22/22 , H01L25/0657 , H01L2225/06544 , H01L2924/014
Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.
Abstract translation: 垂直连接的水平定向集成电路（IC）的堆叠可以具有从一个IC的前侧到另一个IC的背面的电连接。 电信号可以通过通过硅通孔的通过衬底通孔（TSV）从一个IC的背面转移到同一IC的前侧。 电子设备，系统和方法可以用于测试和/或替换有缺陷的TSV。 公开了附加装置，系统和方法。
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公开(公告)号：US09318394B2
公开(公告)日：2016-04-19
申请号：US14494147
申请日：2014-09-23
Applicant: Micron Technology, Inc.
Inventor： Ebrahim H Hargan , Layne Bunker , Dragos Dimitriu , Gregory A. King
CPC classification number: H01L22/32 , G01R31/2853 , G01R31/2894 , G11C29/02 , G11C29/022 , G11C29/025 , G11C29/816 , G11C2029/5006 , H01L22/14 , H01L22/22 , H01L25/0657 , H01L2225/06544 , H01L2924/014
Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.
Abstract translation: 垂直连接的水平定向集成电路（IC）的堆叠可以具有从一个IC的前侧到另一个IC的背面的电连接。 电信号可以通过通过硅通孔的通过衬底通孔（TSV）从一个IC的背面转移到同一IC的前侧。 电子设备，系统和方法可以用于测试和/或替换有缺陷的TSV。 公开了附加装置，系统和方法。
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