公开(公告)号：US11811874B2

公开(公告)日：2023-11-07

申请号：US17719790

申请日：2022-04-13

Applicant: Micron Technology, Inc.

Inventor： Sharmila Velamur ,  Fatma Arzum Simsek-Ege ,  Shivani Srivastava ,  Marsela Pontoh ,  Lavanya Sriram

IPC: H04L67/125 ,  H04L67/00

CPC classification number: H04L67/125 ,  H04L67/34

Abstract: Methods, systems, and devices associated with an edge device are described. An edge device can include a processing resource and a memory resource having instructions executable to receive, at the processing resource, the memory resource, or both, and from a first source comprising a device in communication with the edge device, first input associated with a user of the device. The instructions can be executable to receive, from a second source, second input associated with a user of the device, determine, based on the first input and the second input, operational instructions for the device and transmit the operational instructions to the device. The instructions can be executable to update, using a machine learning model, the operational instructions responsive to receiving an indication of performance of the operational instructions by the device and responsive to third input received from the first source, the second source, or both.

公开(公告)号：US20240272703A1

公开(公告)日：2024-08-15

申请号：US18438912

申请日：2024-02-12

Applicant: Micron Technology, Inc.

Inventor： Priya Vemparala Guruswamy ,  Barbara J. Bailey ,  Marsela Pontoh ,  Aparna U. Limaye ,  Tejas Jagadeesh

IPC: G06F3/01 ,  G01N33/00 ,  G06V10/10

CPC classification number: G06F3/011 ,  G01N33/0034 ,  G06V10/10

Abstract: Methods, apparatuses, and systems associated with a smart nose with machine learning are described. A system can include a smart nose device configured to receive an odor and create a first odor vector associated with the odor. The system can include an image detection device configured to receive a plurality of images while the odor is received and identify a plurality of objects within the plurality of images. The system can also include a computing device to refine the first odor vector based on the identified plurality of objects, create, utilizing a machine learning model, a second odor vector based on the refined first odor vector and an odor pattern database, and predict the odor based on the second odor vector.

公开(公告)号：US12125796B2

公开(公告)日：2024-10-22

申请号：US18507908

申请日：2023-11-13

Applicant: Micron Technology, Inc.

Inventor： Fatma Arzum Simsek-Ege ,  Luoqi Li ,  Marsela Pontoh

IPC: H01L23/31 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L23/5385 ,  H01L23/31 ,  H01L23/5384 ,  H01L23/5386 ,  H01L25/0657

Abstract: Semiconductor die assemblies with decomposable materials, and associated methods and systems are disclosed. In an embodiment, a semiconductor die assembly includes a memory controller die carrying one or more memory dies attached to its first side. The semiconductor die assembly also includes a biodegradable structure attached to its second side opposite to the first side. The biodegradable structure includes a conductive material and an insulating material, both of which are biodegradable and disintegrate in a wet process. The biodegradable structure can be configured to couple the memory controller die with an interface die. In this manner, when the biodegradable structure disintegrates (e.g., dissolve) in the wet process, the memory controller carrying the memory dies can be separated from the interface die to reclaim the memory controller with the memory dies and the interface die.

公开(公告)号：US20240079338A1

公开(公告)日：2024-03-07

申请号：US18507908

申请日：2023-11-13

Applicant: Micron Technology, Inc.

Inventor： Fatma Arzum Simsek-Ege ,  Luoqi Li ,  Marsela Pontoh

IPC: H01L23/538 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/5385 ,  H01L23/31 ,  H01L23/5384 ,  H01L23/5386 ,  H01L25/0657

Abstract: Semiconductor die assemblies with decomposable materials, and associated methods and systems are disclosed. In an embodiment, a semiconductor die assembly includes a memory controller die carrying one or more memory dies attached to its first side. The semiconductor die assembly also includes a biodegradable structure attached to its second side opposite to the first side. The biodegradable structure includes a conductive material and an insulating material, both of which are biodegradable and disintegrate in a wet process. The biodegradable structure can be configured to couple the memory controller die with an interface die. In this manner, when the biodegradable structure disintegrates (e.g., dissolve) in the wet process, the memory controller carrying the memory dies can be separated from the interface die to reclaim the memory controller with the memory dies and the interface die.

公开(公告)号：US20220329657A1

公开(公告)日：2022-10-13

申请号：US17719790

申请日：2022-04-13

Applicant: Micron Technology, Inc.

Inventor： Sharmila Velamur ,  Fatma Arzum Simsek-Ege ,  Shivani Srivastava ,  Marsela Pontoh ,  Lavanya Sriram

IPC: H04L67/125 ,  H04L67/00

Abstract: Methods, systems, and devices associated with an edge device are described. An edge device can include a processing resource and a memory resource having instructions executable to receive, at the processing resource, the memory resource, or both, and from a first source comprising a device in communication with the edge device, first input associated with a user of the device. The instructions can be executable to receive, from a second source, second input associated with a user of the device, determine, based on the first input and the second input, operational instructions for the device and transmit the operational instructions to the device. The instructions can be executable to update, using a machine learning model, the operational instructions responsive to receiving an indication of performance of the operational instructions by the device and responsive to third input received from the first source, the second source, or both.

公开(公告)号：US20250046723A1

公开(公告)日：2025-02-06

申请号：US18922192

申请日：2024-10-21

Applicant: Micron Technology, Inc.

Inventor： Fatma Arzum Simsek-Ege ,  Luoqi Li ,  Marsela Pontoh

IPC: H01L23/538 ,  H01L23/31 ,  H01L25/065

Abstract: Semiconductor die assemblies with decomposable materials, and associated methods and systems are disclosed. In an embodiment, a semiconductor die assembly includes a memory controller die carrying one or more memory dies attached to its first side. The semiconductor die assembly also includes a biodegradable structure attached to its second side opposite to the first side. The biodegradable structure includes a conductive material and an insulating material, both of which are biodegradable and disintegrate in a wet process. The biodegradable structure can be configured to couple the memory controller die with an interface die. In this manner, when the biodegradable structure disintegrates (e.g., dissolve) in the wet process, the memory controller carrying the memory dies can be separated from the interface die to reclaim the memory controller with the memory dies and the interface die.

公开(公告)号：US11323521B1

公开(公告)日：2022-05-03

申请号：US17225204

申请日：2021-04-08

Applicant: Micron Technology, Inc.

Inventor： Sharmila Velamur ,  Fatma Arzum Simsek-Ege ,  Shivani Srivastava ,  Marsela Pontoh ,  Lavanya Sriram

IPC: G06F15/16 ,  H04L67/125 ,  H04L67/00

Abstract: Methods, systems, and devices associated with an edge device are described. An edge device can include a processing resource and a memory resource having instructions executable to receive, at the processing resource, the memory resource, or both, and from a first source comprising a device in communication with the edge device, first input associated with a user of the device. The instructions can be executable to receive, from a second source, second input associated with a user of the device, determine, based on the first input and the second input, operational instructions for the device and transmit the operational instructions to the device. The instructions can be executable to update, using a machine learning model, the operational instructions responsive to receiving an indication of performance of the operational instructions by the device and responsive to third input received from the first source, the second source, or both.

公开(公告)号：US11817393B2

公开(公告)日：2023-11-14

申请号：US17463994

申请日：2021-09-01

Applicant: Micron Technology, Inc.

Inventor： Fatma Arzum Simsek-Ege ,  Luoqi Li ,  Marsela Pontoh

IPC: H01L23/31 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L23/5385 ,  H01L23/31 ,  H01L23/5384 ,  H01L23/5386 ,  H01L25/0657

Abstract: Semiconductor die assemblies with decomposable materials, and associated methods and systems are disclosed. In an embodiment, a semiconductor die assembly includes a memory controller die carrying one or more memory dies attached to its first side. The semiconductor die assembly also includes a biodegradable structure attached to its second side opposite to the first side. The biodegradable structure includes a conductive material and an insulating material, both of which are biodegradable and disintegrate in a wet process. The biodegradable structure can be configured to couple the memory controller die with an interface die. In this manner, when the biodegradable structure disintegrates (e.g., dissolve) in the wet process, the memory controller carrying the memory dies can be separated from the interface die to reclaim the memory controller with the memory dies and the interface die.

公开(公告)号：US20230069261A1

公开(公告)日：2023-03-02

申请号：US17463994

申请日：2021-09-01

Applicant: Micron Technology, Inc.

Inventor： Fatma Arzum Simsek-Ege ,  Luoqi Li ,  Marsela Pontoh

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/31

Abstract: Semiconductor die assemblies with decomposable materials, and associated methods and systems are disclosed. In an embodiment, a semiconductor die assembly includes a memory controller die carrying one or more memory dies attached to its first side. The semiconductor die assembly also includes a biodegradable structure attached to its second side opposite to the first side. The biodegradable structure includes a conductive material and an insulating material, both of which are biodegradable and disintegrate in a wet process. The biodegradable structure can be configured to couple the memory controller die with an interface die. In this manner, when the biodegradable structure disintegrates (e.g., dissolve) in the wet process, the memory controller carrying the memory dies can be separated from the interface die to reclaim the memory controller with the memory dies and the interface die.