公开(公告)号：US10297574B2

公开(公告)日：2019-05-21

申请号：US14258875

申请日：2014-04-22

Applicant: Micron Technology, Inc.

Inventor： David J. Corisis ,  Matt Schwab

IPC: H01L25/18 ,  H01L25/065

Abstract: There is provided a semiconductor device assembly with an interposer and method of manufacturing the same. More specifically, in one embodiment, there is provided a semiconductor device assembly comprising a semiconductor substrate, at least one semiconductor die attached to the semiconductor substrate, an interposer disposed on the semiconductor die, and a controller attached to the interposer. There is also provided a method of manufacturing comprising forming a first subassembly by coupling a substrate and a semiconductor die, and forming second subassembly by attaching a controller to an interposer, and coupling the first subassembly to the second subassembly.

公开(公告)号：US20140225282A1

公开(公告)日：2014-08-14

申请号：US14258875

申请日：2014-04-22

Applicant: Micron Technology, Inc.

Inventor： David J. Corisis ,  Matt Schwab

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  H01L25/18 ,  H01L2224/48145 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00012

Abstract: There is provided a semiconductor device assembly with an interposer and method of manufacturing the same. More specifically, in one embodiment, there is provided a semiconductor device assembly comprising a semiconductor substrate, at least one semiconductor die attached to the semiconductor substrate, an interposer disposed on the semiconductor die, and a controller attached to the interposer. There is also provided a method of manufacturing comprising forming a first subassembly by coupling a substrate and a semiconductor die, and forming second subassembly by attaching a controller to an interposer, and coupling the first subassembly to the second subassembly.

Abstract translation: 提供了一种具有插入件的半导体器件组件及其制造方法。 更具体地，在一个实施例中，提供了一种半导体器件组件，包括半导体衬底，附接到半导体衬底的至少一个半导体管芯，设置在半导体管芯上的插入器和附接到插入器的控制器。 还提供了一种制造方法，包括通过耦合衬底和半导体管芯来形成第一子组件，以及通过将控制器附接到插入件来形成第二子组件，以及将第一子组件耦合到第二子组件。

公开(公告)号：US20190237436A1

公开(公告)日：2019-08-01

申请号：US16378260

申请日：2019-04-08

Applicant: Micron Technology, Inc.

Inventor： David J. Corisis ,  Matt Schwab

IPC: H01L25/065 ,  H01L25/18

CPC classification number: H01L25/0657 ,  H01L25/18 ,  H01L2224/48145 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00012

Abstract: There is provided a semiconductor device assembly with an interposer and method of manufacturing the same. More specifically, in one embodiment, there is provided a semiconductor device assembly comprising a semiconductor substrate, at least one semiconductor die attached to the semiconductor substrate, an interposer disposed on the semiconductor die, and a controller attached to the interposer. There is also provided a method of manufacturing comprising forming a first subassembly by coupling a substrate and a semiconductor die, and forming second subassembly by attaching a controller to an interposer, and coupling the first subassembly to the second subassembly.