公开(公告)号：US11742282B2

公开(公告)日：2023-08-29

申请号：US16988422

申请日：2020-08-07

申请人： Micron Technology, Inc.

发明人： Jordan D. Greenlee ,  Rita J. Klein ,  Everett A. McTeer ,  John D. Hopkins ,  Shuangqiang Luo ,  Song Kai Tan ,  Jing Wai Fong ,  Anurag Jindal ,  Chieh Hsien Quek

IPC分类号： H01L23/522 ,  H01L21/768 ,  H10B43/27 ,  H01L23/532

CPC分类号： H01L23/5226 ,  H01L21/76843 ,  H01L21/76847 ,  H01L21/76877 ,  H10B43/27 ,  H01L23/53209 ,  H01L23/53266

摘要： Some embodiments include conductive interconnects which include the first and second conductive materials, and which extend upwardly from a conductive structure. Some embodiments include integrated assemblies having conductive interconnects.