公开(公告)号：US20200273719A1

公开(公告)日：2020-08-27

申请号：US16802544

申请日：2020-02-26

申请人： Miki TRIFUNOVIC ,  Aditi CHANDRA ,  Anand DESHPANDE ,  Arvind KAMATH

发明人： Miki TRIFUNOVIC ,  Aditi CHANDRA ,  Anand DESHPANDE ,  Arvind KAMATH

IPC分类号： H01L21/48 ,  H01L21/78 ,  H01L23/495 ,  H01L23/66 ,  H01Q1/38

摘要： A method of attaching one or more active devices on one or more substrates to a metal carrier by “hot stamping” is disclosed. The method includes contacting the active device(s) on the substrate(s) with the metal carrier, and applying pressure to and heating the active device(s) on the substrate(s) and the metal carrier sufficiently to affix or attach the active device(s) on the substrate(s) to the metal carrier. The active device(s) may include an integrated circuit. The substrate(s) may include a metal substrate on the backside of the active device and a protective/carrier film on the frontside of the active device. The protective/carrier film may be or include an organic polymer. The metal carrier may be or include a metal foil. Various examples of the method further include thinning the metal substrate, dicing the active device(s) and a continuous substrate, and/or separating the active devices.

公开(公告)号：US20190267698A1

公开(公告)日：2019-08-29

申请号：US16287126

申请日：2019-02-27

申请人： Somnath MUKHERJEE ,  Aditi CHANDRA ,  Mao ITO ,  Arvind KAMATH ,  Scott BRUNER ,  Sambhu KUNDU ,  Anand DESHPANDE

发明人： Somnath MUKHERJEE ,  Aditi CHANDRA ,  Mao ITO ,  Arvind KAMATH ,  Scott BRUNER ,  Sambhu KUNDU ,  Anand DESHPANDE

IPC分类号： H01Q1/22 ,  H01L23/532 ,  H01L23/66 ,  H01L23/64 ,  H01L23/522 ,  H01L23/528

摘要： A wireless communication device having an integrated antenna, and methods for making and using the same are disclosed. The device generally includes (a) a substrate; (b) an integrated circuit (IC) comprising a plurality of printed and/or thin film layers and/or structures on the substrate, (c) a dielectric or insulator layer in at least one area of the substrate other than the IC; and (d) an antenna on the dielectric or insulator layer, comprising one or more metal traces. The plurality of printed and/or thin film layers and/or structures include an uppermost layer of metal. The antenna has (i) an inner terminal continuous with the uppermost layer of metal or connected to the uppermost layer of metal through one or more contacts, and (ii) an outer terminal connected to the uppermost layer of metal through one or more contacts and optionally a metal bridge or strap