公开(公告)号：US20240125736A1

公开(公告)日：2024-04-18

申请号：US18090950

申请日：2022-12-29

Applicant: Ming Chi University of Technology

Inventor： Sajal BIRING ,  Sheng-Chi Chen ,  Annada Sankar SADHU ,  Min-Chen Chuang ,  Kuan-Yu Chien

IPC: G01N27/622 ,  G01N33/18 ,  H01L21/02

CPC classification number: G01N27/622 ,  G01N33/1813 ,  H01L21/02186 ,  H01L21/02381

Abstract: The present invention relates to a Cu ion sensor, which greatly improves the sensitivity to Cu by a nitrogen-rich surface of a copper nitride thin film doped with a metal material. The present invention also relates to a Cu ion sensing method, in which Cu2+ is detected by contacting the Cu ion sensor of the present invention with the solution to be tested, and using the change in electrical conductivity of a copper nitride film doped with a metal material in the presence of Cu2+ in the solution.