公开(公告)号：US20100105172A1

公开(公告)日：2010-04-29

申请号：US12258675

申请日：2008-10-27

申请人： Ming LI ,  Ying DING ,  Ping Liang TU ,  King Ming LO ,  Kwok Kee Chung

发明人： Ming LI ,  Ying DING ,  Ping Liang TU ,  King Ming LO ,  Kwok Kee Chung

IPC分类号： H01L21/00

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32506 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature T1 so as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards T2 and solidifies.

摘要翻译： 提供一种用于接合包含熔点Tm的焊料层的管芯的方法。 将接合头加热到高于Tm的接合头设定温度T1，将衬底加热到​​低于Tm的衬底设定温度T2。 然后，接合头拾取模具并将模具朝向温度T1加热，以熔化焊料层。 将模具的焊料层压在基板上，以将模具结合到基板上，然后将结合头与模具分离，使得焊料层朝T2冷却并固化。