公开(公告)号：US20100105172A1

公开(公告)日：2010-04-29

申请号：US12258675

申请日：2008-10-27

申请人： Ming LI ,  Ying DING ,  Ping Liang TU ,  King Ming LO ,  Kwok Kee Chung

发明人： Ming LI ,  Ying DING ,  Ping Liang TU ,  King Ming LO ,  Kwok Kee Chung

IPC分类号： H01L21/00

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32506 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature T1 so as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards T2 and solidifies.

摘要翻译： 提供一种用于接合包含熔点Tm的焊料层的管芯的方法。 将接合头加热到高于Tm的接合头设定温度T1，将衬底加热到​​低于Tm的衬底设定温度T2。 然后，接合头拾取模具并将模具朝向温度T1加热，以熔化焊料层。 将模具的焊料层压在基板上，以将模具结合到基板上，然后将结合头与模具分离，使得焊料层朝T2冷却并固化。

公开(公告)号：US20190174600A1

公开(公告)日：2019-06-06

申请号：US16220768

申请日：2018-12-14

申请人： Arunava Dutta ,  Anne Janet Milliez ,  Ming LI

发明人： Arunava Dutta ,  Anne Janet Milliez ,  Ming LI

IPC分类号： H05B33/08 ,  F21K9/232

摘要： A lamp including a first group of solid state light emitters that produce a general illumination light mode. The general illumination light mode is provided by a first range of light wavelengths emitted by the first group of solid state light emitters having a correlated color temperature ranging from 2700K to 6500K. The lamp also includes a second group of solid state light emitters that emit a second range of light wavelengths that are not visible to insects in a substantially insect free illumination light mode. The second range of light wavelengths have a spectral power ratio of wavelengths of less than substantially 550 nm to a total spectra of less than 700 nm, that is equal to 5.8% or less. The lamp further includes the ability to switch between the two modes of light.

公开(公告)号：US20130327812A1

公开(公告)日：2013-12-12

申请号：US13494499

申请日：2012-06-12

申请人： Ming LI ,  Dewen TIAN ,  Madhukumar JANARDHANAN PILLAI

发明人： Ming LI ,  Dewen TIAN ,  Madhukumar JANARDHANAN PILLAI

IPC分类号： B23K31/12

CPC分类号： B23K20/007 ,  H01L22/12 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/78301 ,  H01L2224/78308 ,  H01L2224/78901 ,  H01L2224/7892 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00

摘要： For selecting suitable bonding parameters for forming wire bonds onto bond pads of a substrate, one or more indentations are made onto at least one bond pad of the substrate with an indentation tool by applying a series of predetermined forces onto the at least one bond pad with the indentation tool. A depth-force profile of the substrate is measured comprising a relationship between each predetermined force that is applied and a resultant depth of the indentation made by the indentation tool. An appropriate set of bonding parameters suitable for forming wire bonds on the substrate is determined based on the measured depth-force profile.

摘要翻译： 为了选择合适的接合参数以在基板的接合焊盘上形成引线键合，用压痕工具将一个或多个凹陷制成在衬底的至少一个接合焊盘上，通过将一系列预定的力施加到至少一个接合焊盘上， 缩进工具。 测量衬底的深度力分布，其包括施加的每个预定力与由压痕工具制成的压痕的合成深度之间的关系。 基于测量的深度 - 力分布来确定适合于在基底上形成线接合的适当的粘结参数。

公开(公告)号：US20130013730A1

公开(公告)日：2013-01-10

申请号：US13179155

申请日：2011-07-08

申请人： Ming LI ,  Philip LIN

发明人： Ming LI ,  Philip LIN

IPC分类号： G06F15/16

CPC分类号： H04L61/1511 ,  H04L65/80

摘要： A content delivery network aggregator system is disclosed. A user requesting content from a content provider has his or her DNS request forwarded to a CDN selector. The CDN selector intelligently selects an optimal CDN from amongst a number of partner CDNs to provide the requested content. The CDN selector selects one of the plurality of content delivery networks for providing content to a user based upon an analysis of a plurality of performance variables for each of the plurality of content delivery networks.

摘要翻译： 公开了内容传送网络聚合器系统。 从内容提供商请求内容的用户将其DNS请求转发到CDN选择器。 CDN选择器从多个伙伴CDN中智能地选择最佳CDN以提供所请求的内容。 CDN选择器基于对多个内容递送网络中的每一个的多个性能变量的分析来选择多个内容递送网络中的一个，以向用户提供内容。

公开(公告)号：US20100320602A1

公开(公告)日：2010-12-23

申请号：US12526234

申请日：2008-02-20

申请人： Ming LI

发明人： Ming LI

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L23/552 ,  H01L23/49838 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/11015 ,  H01L2224/11334 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The semiconductor package includes a dielectric layer, a trace layer, a conductive layer, a die and an underfill layer. The dielectric layer has first side and an opposing dielectric layer second side. Multiple vias extend through the dielectric layer from the dielectric layer first side to the dielectric layer second side. Multiple solder balls are disposed at the dielectric layer second side. Each of the solder balls is electrically coupled to a different one of the vias. The die is electrically coupled to the solder balls. The conductive layer is disposed between the dielectric layer second side and the die. The conductive layer defines a window there through for allowing the solder balls to electrically couple to the vias without contacting the conductive layer, i.e., no physical or electrical contact. The underfill layer is formed between the die and the conductive layer, while the trace layer is formed at the dielectric layer first side. Traces of the trace layer electrically couple the vias to other solder balls.

摘要翻译： 半导体封装包括电介质层，迹线层，导电层，管芯和底部填充层。 电介质层具有第一侧和相对的电介质层第二侧。 多个通孔从电介质层第一侧延伸到电介质层第二侧。 多个焊球设置在电介质层第二侧。 每个焊球电耦合到不同的一个通孔。 模具电耦合到焊球。 导电层设置在电介质层第二侧和管芯之间。 导电层在其上限定了一个窗口，以允许焊球电气耦合到通孔而不接触导电层，即没有物理或电接触。 在芯片和导电层之间形成底部填充层，同时在电介质层第一侧形成迹线层。 痕迹层的迹线将通孔电耦合到其他焊球。

公开(公告)号：US20100118790A1

公开(公告)日：2010-05-13

申请号：US12691068

申请日：2010-01-21

申请人： Xiaolong GUO ,  Lan LIU ,  Ming LI ,  Wanqiang ZHANG

发明人： Xiaolong GUO ,  Lan LIU ,  Ming LI ,  Wanqiang ZHANG

IPC分类号： H04W8/00

CPC分类号： H04W60/06 ,  H04W8/04 ,  H04W76/32 ,  H04W88/02 ,  H04W88/16

摘要： A method of bearer deletion is provided to improve the universality of the bearer deletion process. The method includes: receiving, by the original intermediate NE, the cancellation type indication parameter sent by the HSS, and deleting the bearer between the serving gateway (S-GW) and a packet data network gateway (P-GW), if the original intermediate network element obtains an attach type according to the cancellation type indication parameter indicating an attach type and a corresponding bearer exists on the original intermediate NE. This method helps efficiently improve the universality of the bearer deletion flow.

摘要翻译： 提供承载删除的方法以改善承载删除过程的普遍性。 该方法包括：由原始中间网元接收HSS发送的消除类型指示参数，并删除服务网关（S-GW）与分组数据网络网关（P-GW）之间的承载，如果原始 中间网元根据指示附着类型的消除类型指示参数获得附着类型，并且在原始中间网元上存在相应的承载。 该方法有效地提高了承载删除流的普遍性。

公开(公告)号：US20180002201A1

公开(公告)日：2018-01-04

申请号：US15687270

申请日：2017-08-25

申请人： Minxiong LUO ,  Ming LI

发明人： Minxiong LUO ,  Ming LI

IPC分类号： C02F1/461

CPC分类号： C02F1/46104 ,  C02F1/461 ,  C02F2001/46152 ,  C02F2201/4611 ,  C02F2201/46155 ,  C02F2307/10

摘要： A multifunctional membraneless boiled water electrolysis machine comprises a container (21) for containing raw water, and a water electrolysis apparatus. The water electrolysis apparatus is mounted outside the container (21) for containing raw water and comprises an electrolysis power supply (9), an electrolysis water tank (10) and an electrolysis electrode assembly (18) located in the electrolysis water tank. A water outlet at a bottom of the container for containing the raw water is connected with a water pump (24) through a pipeline. The water pump (24) is connected with a water inlet (15) of the electrolysis water tank (10) through the pipeline. The raw water in the container can flow into the electrolysis electrode assembly (18) from the water inlet (15) of the electrolysis water tank (10) after being heated or boiled by a heater (16). The water is electrolyzed through the gaps between the electrodes of different polarities in the electrolysis electrode assembly (18). The electrolyzed water flows from a water outlet (28) of the electrolysis water tank (10) to satisfy needs of people for the electrolyzed water of different water temperatures.

公开(公告)号：US20130271230A1

公开(公告)日：2013-10-17

申请号：US13448549

申请日：2012-04-17

申请人： Ming LI ,  Khelifa Hettak ,  Rony E. Amaya ,  Adrian Momciu ,  Luc A. Desormeaux ,  Valek Szwarc

发明人： Ming LI ,  Khelifa Hettak ,  Rony E. Amaya ,  Adrian Momciu ,  Luc A. Desormeaux ,  Valek Szwarc

IPC分类号： H03B5/12

CPC分类号： H03B5/1841 ,  H03B5/1215 ,  H03B5/1228 ,  H03B5/1243 ,  H03B5/1852 ,  H03B2200/0024

摘要： A standing wave oscillator includes a cross-coupled differential transistor pair having a pair of input terminals and a pair of output terminals; and a resonant circuit coupled to the input terminals of the cross-coupled differential transistor pair. The resonant circuit includes: a capacitance between the input terminals of the cross-coupled differential transistor pair; and a differential dual-mode coplanar waveguide (CPW) having opposite differential ends thereof connected to respective input terminals of the cross-coupled differential transistor pair. CPW ground lines of the differential dual-mode coplanar waveguide each have a first end thereof connected to the first supply voltage and have a second end thereof floating or unterminated.

摘要翻译： 驻波振荡器包括具有一对输入端和一对输出端的交叉耦合差分晶体管对; 以及耦合到交叉耦合差动晶体管对的输入端的谐振电路。 谐振电路包括：交叉耦合差分晶体管对的输入端之间的电容; 和具有相对差分端的差分双模共面波导（CPW）连接到交叉耦合差分晶体管对的相应输入端。 差分双模共面波导的CPW接地线各自具有连接到第一电源电压的第一端，并且其第二端浮动或未端接。

公开(公告)号：US20130013764A1

公开(公告)日：2013-01-10

申请号：US13178828

申请日：2011-07-08

申请人： Ming LI ,  Philip LIN

发明人： Ming LI ,  Philip LIN

IPC分类号： G06F15/173

CPC分类号： H04L67/101 ,  H04L61/1511 ,  H04L67/322 ,  H04N21/2402 ,  H04N21/4622 ,  H04N21/64723

摘要： A content delivery network (CDN) aggregation system is disclosed. A user requesting content from a content provider has his or her DNS request forwarded to a CDN selector. The CDN selector intelligently selects an optimal CDN from amongst a number of partner CDNs to provide the requested content.

摘要翻译： 公开了内容传送网络（CDN）聚合系统。 从内容提供商请求内容的用户将其DNS请求转发到CDN选择器。 CDN选择器从多个伙伴CDN中智能地选择最佳CDN以提供所请求的内容。

公开(公告)号：US20120076035A1

公开(公告)日：2012-03-29

申请号：US13313456

申请日：2011-12-07

申请人： Jinyi ZHOU ,  Lan LIU ,  Xiaolong GUO ,  Ming LI ,  Zhe CHEN ,  Qi YU

发明人： Jinyi ZHOU ,  Lan LIU ,  Xiaolong GUO ,  Ming LI ,  Zhe CHEN ,  Qi YU

IPC分类号： H04W24/00 ,  H04L12/26

CPC分类号： H04L12/66 ,  H04W28/0268 ,  H04W72/087 ,  H04W76/10 ,  H04W76/11 ,  H04W76/12

摘要： Method and system for setting up a bearer are disclosed. The bearer setup method includes these steps: a packet data network gateway (PGW) obtains first quality of service (QoS) information and a first bearer identifier (ID), and sets up a bearer between the PGW and a radio access network (RAN) according to the first QoS information, where the bearer is associated with the first bearer ID; the RAN sets up a radio bearer (RB) with a user equipment (UE) according to second QoS information associated with the first QoS information, where the RB is associated with a second bearer ID associated with the first bearer ID.

摘要翻译： 公开了建立承载的方法和系统。 承载建立方法包括以下步骤：分组数据网络网关（PGW）获得第一服务质量（QoS）信息和第一承载标识符（ID），并且在PGW和无线接入网络（RAN）之间建立承载， 根据第一QoS信息，其中承载与第一承载ID相关联; RAN根据与第一QoS信息相关联的第二QoS信息与用户设备（UE）建立无线承载（RB），其中RB与与第一承载ID相关联的第二承载ID相关联。