公开(公告)号：US20100245264A1

公开(公告)日：2010-09-30

申请号：US12414674

申请日：2009-03-31

Applicant: Ming-Cho Wu ,  Ching-Hui Lin

Inventor： Ming-Cho Wu ,  Ching-Hui Lin

IPC: G06F3/041 ,  G01B11/14

CPC classification number: G06F3/0423

Abstract: In the specification and drawing, an optical detection apparatus is described and shown with scanning devices, detectors, and a processing unit, wherein the scanning devices are positioned to scan a detection region with different light wavelengths.

Abstract translation: 在说明书和附图中，对扫描装置，检测器和处理单元进行了描述和示出的光学检测装置，其中扫描装置被定位成扫描具有不同光波长的检测区域。

公开(公告)号：US20100207909A1

公开(公告)日：2010-08-19

申请号：US12371228

申请日：2009-02-13

Applicant: Ming-Cho Wu ,  Chui-Yao Chiu ,  Ching-Hui Lin ,  Hung-Ching Duan

Inventor： Ming-Cho Wu ,  Chui-Yao Chiu ,  Ching-Hui Lin ,  Hung-Ching Duan

IPC: G06F3/042 ,  G01N21/55 ,  G01B11/14

CPC classification number: G06F3/0421

Abstract: Disclosed herein includes a module and an optical detection device comprising the same for determining a touch position on a screen caused by an object, such as a finger of a user or a stylus pen.

Abstract translation: 本文公开了一种模块和光学检测装置，其包括用于确定由诸如用户的手指或触控笔的物体引起的屏幕上的触摸位置的光学检测装置。

公开(公告)号：US20060284305A1

公开(公告)日：2006-12-21

申请号：US11450552

申请日：2006-06-12

Applicant: Hsien-Cheng Yen ,  Hung-Sheng Lee ,  Ming-Cho Wu ,  Szutsun-Simon Ou

Inventor： Hsien-Cheng Yen ,  Hung-Sheng Lee ,  Ming-Cho Wu ,  Szutsun-Simon Ou

IPC: H01L23/14

CPC classification number: H01S5/024 ,  H01L33/641 ,  H01S5/02212

Abstract: A packaging base for semiconductor elements is made of metal powder selected from the group consisting of cupper (Cu), iron (Fe), wolfram (W), molybdenum (Mo), aluminum (Al), indium (In), and gallium (Ga) or from an alloy of combinations thereof. A heat sink is integrally formed by metallurgical injection molding process. A fixing mount and a protection mount are positioned on the heat sink, thereby creating a packaging base structure. The protection mount surrounds the fixing mount for protecting semiconductor elements like laser diode dies. The packaging base structure includes a mounting gap for the purpose of an easy installation of the semiconductor elements. In this way, the reduction of the heat-removal capacity caused by the thermal contact resistance of the conventional configuration can be avoided so that the cooling effect can be enhanced. Meanwhile, the fabrication process is simplified.

Abstract translation: 用于半导体元件的封装基底由选自铜（Cu），铁（Fe），钨（W），钼（Mo），铝（Al），铟（In）和镓 Ga）或其组合的合金。 散热器通过冶金注射成型工艺整体形成。 固定座和保护座位于散热器上，从而形成包装基座结构。 保护安装件围绕用于保护半导体元件的激光二极管管芯的固定安装座。 包装基座结构包括用于容易安装半导体元件的安装间隙。 以这种方式，可以避免由常规结构的热接触电阻引起的除热能力的降低，从而可以提高冷却效果。 同时，简化了制作工艺。