摘要:
A defect inspection method for inspecting a defect on a semiconductor wafer, using plural inspection methods includes: merging hot-spot coordinates as coordinates on the semiconductor wafer, designated by a user, or coordinates where a systematic defect can occur, with detected defect coordinates on the semiconductor wafer, acquired from inspection information, after information indicating the type of coordinates are added thereto; deciding an inspection sequence of the coordinates merged with each other; and defect inspection for executing selection using the information indicating the respective types of the coordinates merged with each other, and executing an inspection by selecting an inspection method for every coordinates to be inspected.
摘要:
A defect inspection method for inspecting a defect on a semiconductor wafer, using plural inspection methods includes: merging hot-spot coordinates as coordinates on the semiconductor wafer, designated by a user, or coordinates where a systematic defect can occur, with detected defect coordinates on the semiconductor wafer, acquired from inspection information, after information indicating the type of coordinates are added thereto; deciding an inspection sequence of the coordinates merged with each other; and defect inspection for executing selection using the information indicating the respective types of the coordinates merged with each other, and executing an inspection by selecting an inspection method for every coordinates to be inspected.
摘要:
For inspection of a pattern such as a semiconductor device, it is useful to selectively detect a defect on the specific pattern in order to estimate the cause of the occurrence of the defect. An object of the invention is to provide a charged particle beam apparatus capable of setting, on the basis of the shape of the pattern on a sample, a region to be inspected. The invention is characterized in that the contour of the pattern on the sample is extracted using a template image obtained on the basis of an image of the sample, the region to be inspected is set on the basis of the contour of the pattern, a defect candidate is detected by comparing the image to be inspected with a comparative image, and the sample is inspected using a positional relationship between the region to be inspected and the defect candidate included in the region to be inspected.
摘要:
For inspection of a pattern such as a semiconductor device, it is useful to selectively detect a defect on the specific pattern in order to estimate the cause of the occurrence of the defect. An object of the invention is to provide a charged particle beam apparatus capable of setting, on the basis of the shape of the pattern on a sample, a region to be inspected. The invention is characterized in that the contour of the pattern on the sample is extracted using a template image obtained on the basis of an image of the sample, the region to be inspected is set on the basis of the contour of the pattern, a defect candidate is detected by comparing the image to be inspected with a comparative image, and the sample is inspected using a positional relationship between the region to be inspected and the defect candidate included in the region to be inspected.
摘要:
The present invention relates to a defect inspection apparatus for inspecting defects in patterns formed on a semiconductor device, on the GUI of which for the confirmation of the inspection results an area is provided for displaying any one of or facing each other the features amount of defects, and the image during inspection or the reacquired image, and on the GUI of which a means is provided for setting the classification class and importance of the defects, and based on the classification class and the importance of the defects information set by this setting means, the classification conditions or the defect judging conditions are automatically or manually set so that the inspection conditions may be set easily.
摘要:
A charged particle application circuit pattern inspection apparatus and method are disclosed, in which the reduction in the rejection rate attributable to an out-of-focus state due to the change in the charge condition on the sample surface is prevented and the false information is reduced to improve the apparatus reliability. The image acquisition position on a sample is stored in an image acquisition position storage unit, a focus correction value is stored in a focus correction value storage unit in accordance with the image acquisition position and the sample charge condition, the inspection conditions and the sample to be inspected are input from an input unit, the sample charge condition is evaluated in accordance with the image position acquisition position, and the focal point is corrected by a focus correction unit.
摘要:
An apparatus for forming an image corresponding to an input image signal, includes a light beam generator for generating a light beam; a driver for driving the light beam generator; and an image outputting device for scanning the generated light beam which has been reflected by a rotary polygonal mirror to a recording medium in a primary direction and, for moving the recording medium in a secondary direction substantially perpendicular to the primary direction so that the image is formed. A periodical modulation signal generator changes a phase or an amplitude of a first reference signal including a fundamental frequency having a period corresponding to one rotation of the rotary polygonal mirror, and generates a plurality of periodical modulation signals having different phases or different amplitudes from each other. A multiplier multiplies a second reference signal having a predetermined frequency value by the plurality of periodical modulation signals respectively. A controller controls the driver and the image outputting device in accordance with a plurality of multiplied periodical signals, and forms images respectively corresponding to the plurality of multiplied periodical signals. A periodical modulation signal inputting device inputs a first periodical modulation signal corresponding to a first position on the recording medium, and a second periodical modulation signal corresponding to a second position different from the first position. A calculator generates an unevenness correction signal in response to the inputted first and second periodical modulation signals.
摘要:
The present invention relates to a defect inspection apparatus for inspecting defects in patterns formed on a semiconductor device, on the GUI of which for the confirmation of the inspection results an area is provided for displaying any one of or facing each other the features amount of defects, and the image during inspection or the reacquired image, and on the GUI of which a means is provided for setting the classification class and importance of the defects, and based on the classification class and the importance of the defects information set by this setting means, the classification conditions or the defect judging conditions are automatically or manually set so that the inspection conditions may be set easily.