公开(公告)号：US06613190B2

公开(公告)日：2003-09-02

申请号：US10162574

申请日：2002-06-06

申请人： Minoru Omori ,  Yoshitsugu Uenishi ,  Osamu Tomita ,  Nario Kawakita ,  Masakuni Ogino ,  Yoji Masuda ,  Tsuyoshi Yoshino

发明人： Minoru Omori ,  Yoshitsugu Uenishi ,  Osamu Tomita ,  Nario Kawakita ,  Masakuni Ogino ,  Yoji Masuda ,  Tsuyoshi Yoshino

IPC分类号： B30B1534

CPC分类号： H01G9/012 ,  Y10T29/41 ,  Y10T29/413 ,  Y10T29/417

摘要： A length of metallic lead from having anode terminals and cathode terminals integrally formed with each other extends between upper and lower molds of an apparatus for manufacturing tantalum solid electrolytic capacitors. The cathode terminals are first coated with a thermosetting conductive adhesive, and cathode layers of capacitor elements are then placed on the conductive adhesive. Thereafter, anode leads extending outwardly from the capacitor elements are placed on the anode terminals are joined thereto, respectively, by welding. A pressure is applied to the capacitor elements so that a portion of the conductive adhesive is squeezed out from one surface of each of the plurality of capacitor elements to a neighboring side surface thereof. The cathode terminals are then joined to the capacitor elements, respectively, by heat-curing the conductive adhesive, and the capacitor elements are finally covered with a sheathing resin.

公开(公告)号：US06423104B1

公开(公告)日：2002-07-23

申请号：US09712158

申请日：2000-11-15

申请人： Minoru Omori ,  Yoshitsugu Uenishi ,  Osamu Tomita ,  Nario Kawakita ,  Masakuni Ogino ,  Yoji Masuda ,  Tsuyoshi Yoshino

发明人： Minoru Omori ,  Yoshitsugu Uenishi ,  Osamu Tomita ,  Nario Kawakita ,  Masakuni Ogino ,  Yoji Masuda ,  Tsuyoshi Yoshino

IPC分类号： H01G900

CPC分类号： H01G9/012 ,  Y10T29/41 ,  Y10T29/413 ,  Y10T29/417

摘要： A length of metallic lead from having anode terminals and cathode terminals integrally formed with each other extends between upper and lower molds of an apparatus for manufacturing tantalum solid electrolytic capacitors. The cathode terminals are first coated with a thermosetting conductive adhesive, and cathode layers of capacitor elements are then placed on the conductive adhesive. Thereafter, anode leads extending outwardly from the capacitor elements are placed on the anode terminals are joined thereto, respectively, by welding. A pressure is applied to the capacitor elements so that a portion of the conductive adhesive is squeezed out from one surface of each of the plurality of capacitor elements to a neighboring side surface thereof The cathode terminals are then joined to the capacitor elements, respectively, by heat-curing the conductive adhesive, and the capacitor elements are finally covered with a sheathing resin.

摘要翻译： 具有彼此一体形成的阳极端子和阴极端子的金属引线的长度在用于制造钽固体电解电容器的设备的上模和下模之间延伸。 阴极端子首先涂覆有热固性导电粘合剂，然后将电容器元件的阴极层放置在导电粘合剂上。 此后，分别通过焊接将放置在阳极端子上的从电容器元件向外延伸的阳极引线连接到阳极端子上。 对电容器元件施加压力，使得导电粘合剂的一部分从多个电容器元件的每一个的一个表面挤出到其相邻的侧表面。然后，阴极端子分别通过 热固化导电粘合剂，电容器元件最后用护套树脂覆盖。

公开(公告)号：US06236561B1

公开(公告)日：2001-05-22

申请号：US09334771

申请日：1999-06-16

申请人： Masakuni Ogino ,  Masahiro Yabushita ,  Koji Ueoka ,  Takashi Iwakiri ,  Tsuyoshi Yoshino

发明人： Masakuni Ogino ,  Masahiro Yabushita ,  Koji Ueoka ,  Takashi Iwakiri ,  Tsuyoshi Yoshino

IPC分类号： H01G900

CPC分类号： H01G9/012

摘要： A chip type solid electrolytic capacitor of the present invention has a section formed in a step-wise manner on a cathode lead frame that is connected with a capacitor element. An anode lead wire of the capacitor element is resistance welded to the top of a reversed V-letter shaped structure formed by folding part of an anode lead frame into halves. Further, with the chip type solid electrolytic capacitor of the present invention, part of respective cathode and anode lead frames is exposed outside in such a way as being made flush with the periphery of a resin package, thereby each serving as a terminal. Accordingly, a space problem due to the terminals has been eliminated and the anode lead wire can be made short, thus allowing the volume of a capacitor element employed to be increased. As a result, a chip type solid electrolytic capacitor having a large capacity with its outer dimensions is kept the same as a prior art capacitor can be obtained.

摘要翻译： 本发明的芯片式固体电解电容器具有在与电容器元件连接的阴极引线框上逐步形成的部分。 电容器元件的阳极引线被电阻焊接到通过将阳极引线框架的一部分折叠成半部而形成的反向V字形结构的顶部。 此外，对于本发明的芯片型固体电解电容器，将阴极和阳极引线框架的一部分暴露在外部，使其与树脂封装的周边齐平，从而各自用作端子。 因此，由于端子引起的空间问题已被消除，并且可以使阳极引线短，从而允许增加使用的电容器元件的体积。 结果，具有外形尺寸大的芯片型固体电解电容器保持与现有技术的电容器相同。