摘要:
A length of metallic lead from having anode terminals and cathode terminals integrally formed with each other extends between upper and lower molds of an apparatus for manufacturing tantalum solid electrolytic capacitors. The cathode terminals are first coated with a thermosetting conductive adhesive, and cathode layers of capacitor elements are then placed on the conductive adhesive. Thereafter, anode leads extending outwardly from the capacitor elements are placed on the anode terminals are joined thereto, respectively, by welding. A pressure is applied to the capacitor elements so that a portion of the conductive adhesive is squeezed out from one surface of each of the plurality of capacitor elements to a neighboring side surface thereof. The cathode terminals are then joined to the capacitor elements, respectively, by heat-curing the conductive adhesive, and the capacitor elements are finally covered with a sheathing resin.
摘要:
A length of metallic lead from having anode terminals and cathode terminals integrally formed with each other extends between upper and lower molds of an apparatus for manufacturing tantalum solid electrolytic capacitors. The cathode terminals are first coated with a thermosetting conductive adhesive, and cathode layers of capacitor elements are then placed on the conductive adhesive. Thereafter, anode leads extending outwardly from the capacitor elements are placed on the anode terminals are joined thereto, respectively, by welding. A pressure is applied to the capacitor elements so that a portion of the conductive adhesive is squeezed out from one surface of each of the plurality of capacitor elements to a neighboring side surface thereof The cathode terminals are then joined to the capacitor elements, respectively, by heat-curing the conductive adhesive, and the capacitor elements are finally covered with a sheathing resin.
摘要:
A solid electrolytic capacitor having excellent solder wettability and heat resisting adhesion and a method of manufacturing same are obtained by a simple plating configuration. The capacitor includes a capacitor element, positive electrode terminal and negative electrode terminal. The positive electrode terminal and the negative electrode terminal include a metallic member containing (i) at least one selected from the group consisting of nickel, nickel alloy, copper and copper alloy, (ii) a first plated layer of tin or tin alloy, directly disposed without undercoat on the metallic member, and (iii) an intermetallic compound layer formed between the metallic member and the first plated layer. The intermetallic compound layer contains tin-nickel or tin-copper formed through heat reflow treatment of the metallic member disposed on the first plated layer.
摘要:
A chip type solid electrolytic capacitor of the present invention has a section formed in a step-wise manner on a cathode lead frame that is connected with a capacitor element. An anode lead wire of the capacitor element is resistance welded to the top of a reversed V-letter shaped structure formed by folding part of an anode lead frame into halves. Further, with the chip type solid electrolytic capacitor of the present invention, part of respective cathode and anode lead frames is exposed outside in such a way as being made flush with the periphery of a resin package, thereby each serving as a terminal. Accordingly, a space problem due to the terminals has been eliminated and the anode lead wire can be made short, thus allowing the volume of a capacitor element employed to be increased. As a result, a chip type solid electrolytic capacitor having a large capacity with its outer dimensions is kept the same as a prior art capacitor can be obtained.
摘要:
A solid electrolytic capacitor minimized in both equivalent serial resistance (ESR) and equivalent serial inductance (ESI) by eliminating redundant space created by its electrode is presented. The solid electrolytic capacitor includes a capacitor element including mainly of a positive electrode body, having a positive electrode lead embedded therein, and made of any form of a valve metal, such as a net, a sheet, a foil, and modifications thereof with a rough surface; a positive electrode terminal connected to the positive electrode lead; a negative electrode terminal connected to a negative electrode layer; and a housing resin coated by molding. This improves the installation efficiency of the capacitor element, and contributes to the small, thin structure of the solid electrolytic capacitor.
摘要:
A chip-type filter has a laminated body formed by stacking a plurality of capacitor elements, a pair of positive electrode terminals, a pair of negative electrode terminals, insulating outer resin, and an inductor section. The laminated body includes capacitor elements in a first group and capacitor elements in a second group, the positive electrode sections in both groups are disposed on the opposite sides with respect to the negative electrode sections. Positive electrode terminals are electrically connected to the positive electrode sections of capacitor elements in the first group and those of capacitor elements in the second group, respectively. Negative electrode terminals are electrically connected to the negative electrode sections in the laminated body, and are disposed at both ends of the direction crossing the connecting direction between the positive electrode terminals. The inductor section is insulated from the negative electrode sections and couples the positive electrode terminals.
摘要:
A digital signal processor includes a component for processing a digital signal, a power line for supplying a power to the component, and a decoupling capacitor connected between the power line and a ground. The decoupling capacitor has an equivalent series resistance larger than zero and not larger than 25 mΩ at 100 kHz and an equivalent series inductance larger than zero and not larger than 800 pH at 500 MHz. This digital signal processor does not generate a lot of digital noise, and has a small, thin size.
摘要:
The invention relates to a capacitor device comprising the combination of a cylindrical capacitor and a holder for holding the capacitor in a sideways position. The holder includes a capacitor holding part that has an opening at the top and is arc-shaped in cross section, and a mounting part for mounting the holder itself to another device. The capacitor is held in a sideways position in the holding part of the holder with a heat shrinking resin tube interposed therebetween. Accordingly, the height of the capacitor device is reduced, so that the size of the capacitor device can be reduced. In addition, the connection distance between the capacitor device and another electronic device is shortened, so that the inductance can be made smaller.
摘要:
A method of manufacturing solid electrolytic capacitors which prevents decrease in product yield due to degradation in characteristics of anode foil during a process of forming a MnO2 layer, and achieves high quality solid electrolytic capacitors with high yield, wherein aluminum foil is sampled from each lot before inputting the lot into the next process of forming MnO2 layer on a surface of aluminum foil, and a predetermined inspection is implemented after forming the MnO2 layer on this sample. Based on inspection results, the lot of the sample is input to the next process. This method prevents occurrence of defects in the MnO2 layer formation process in advance, and avoids finding defects after inputting the entire lot of aluminum foil to the MnO2 layer formation process. Consequently, highly reliable solid electrolytic capacitors are manufactured inexpensively and stably without loss in costs and efficiency.
摘要:
A chip type solid electrolytic capacitor includes a capacitor element-laminate. In the capacitor element-laminate, a plurality of capacitor elements, each having an anode portion and a cathode portion, are laminated so that the anode portions of the adjacent capacitor elements are disposed in the direction opposite to each other. Anode lead terminals are joined to the bottom faces of the anode portions of the capacitor elements disposed at both ends of the capacitor element-laminate. A cathode lead terminal is joined to the bottom face of the cathode portion of the capacitor element disposed in the center of the capacitor element-laminate. An Electrically insulating exterior resin coats the capacitor element-laminate so as to expose at least a part of the bottom faces of the anode lead terminals and a part of the cathode lead terminal.