Method of and apparatus for manufacturing tantalum solid electrolytic capacitors
    2.
    发明授权
    Method of and apparatus for manufacturing tantalum solid electrolytic capacitors 有权
    钽固体电解电容器的制造方法和设备

    公开(公告)号:US06423104B1

    公开(公告)日:2002-07-23

    申请号:US09712158

    申请日:2000-11-15

    IPC分类号: H01G900

    摘要: A length of metallic lead from having anode terminals and cathode terminals integrally formed with each other extends between upper and lower molds of an apparatus for manufacturing tantalum solid electrolytic capacitors. The cathode terminals are first coated with a thermosetting conductive adhesive, and cathode layers of capacitor elements are then placed on the conductive adhesive. Thereafter, anode leads extending outwardly from the capacitor elements are placed on the anode terminals are joined thereto, respectively, by welding. A pressure is applied to the capacitor elements so that a portion of the conductive adhesive is squeezed out from one surface of each of the plurality of capacitor elements to a neighboring side surface thereof The cathode terminals are then joined to the capacitor elements, respectively, by heat-curing the conductive adhesive, and the capacitor elements are finally covered with a sheathing resin.

    摘要翻译: 具有彼此一体形成的阳极端子和阴极端子的金属引线的长度在用于制造钽固体电解电容器的设备的上模和下模之间延伸。 阴极端子首先涂覆有热固性导电粘合剂,然后将电容器元件的阴极层放置在导电粘合剂上。 此后,分别通过焊接将放置在阳极端子上的从电容器元件向外延伸的阳极引线连接到阳极端子上。 对电容器元件施加压力,使得导电粘合剂的一部分从多个电容器元件的每一个的一个表面挤出到其相邻的侧表面。然后,阴极端子分别通过 热固化导电粘合剂,电容器元件最后用护套树脂覆盖。

    Chip type solid electrolytic capacitor and its manufacturing method
    4.
    发明授权
    Chip type solid electrolytic capacitor and its manufacturing method 失效
    片式固体电解电容器及其制造方法

    公开(公告)号:US06236561B1

    公开(公告)日:2001-05-22

    申请号:US09334771

    申请日:1999-06-16

    IPC分类号: H01G900

    CPC分类号: H01G9/012

    摘要: A chip type solid electrolytic capacitor of the present invention has a section formed in a step-wise manner on a cathode lead frame that is connected with a capacitor element. An anode lead wire of the capacitor element is resistance welded to the top of a reversed V-letter shaped structure formed by folding part of an anode lead frame into halves. Further, with the chip type solid electrolytic capacitor of the present invention, part of respective cathode and anode lead frames is exposed outside in such a way as being made flush with the periphery of a resin package, thereby each serving as a terminal. Accordingly, a space problem due to the terminals has been eliminated and the anode lead wire can be made short, thus allowing the volume of a capacitor element employed to be increased. As a result, a chip type solid electrolytic capacitor having a large capacity with its outer dimensions is kept the same as a prior art capacitor can be obtained.

    摘要翻译: 本发明的芯片式固体电解电容器具有在与电容器元件连接的阴极引线框上逐步形成的部分。 电容器元件的阳极引线被电阻焊接到通过将阳极引线框架的一部分折叠成半部而形成的反向V字形结构的顶部。 此外,对于本发明的芯片型固体电解电容器,将阴极和阳极引线框架的一部分暴露在外部,使其与树脂封装的周边齐平,从而各自用作端子。 因此,由于端子引起的空间问题已被消除,并且可以使阳极引线短,从而允许增加使用的电容器元件的体积。 结果,具有外形尺寸大的芯片型固体电解电容器保持与现有技术的电容器相同。

    Solid electrolytic capacitor and method of fabricating the same
    5.
    发明授权
    Solid electrolytic capacitor and method of fabricating the same 有权
    固体电解电容器及其制造方法

    公开(公告)号:US06400556B1

    公开(公告)日:2002-06-04

    申请号:US09658666

    申请日:2000-09-08

    IPC分类号: H01G900

    CPC分类号: H01G9/15

    摘要: A solid electrolytic capacitor minimized in both equivalent serial resistance (ESR) and equivalent serial inductance (ESI) by eliminating redundant space created by its electrode is presented. The solid electrolytic capacitor includes a capacitor element including mainly of a positive electrode body, having a positive electrode lead embedded therein, and made of any form of a valve metal, such as a net, a sheet, a foil, and modifications thereof with a rough surface; a positive electrode terminal connected to the positive electrode lead; a negative electrode terminal connected to a negative electrode layer; and a housing resin coated by molding. This improves the installation efficiency of the capacitor element, and contributes to the small, thin structure of the solid electrolytic capacitor.

    摘要翻译: 介绍了通过消除其电极产生的冗余空间,使等效串联电阻(ESR)和等效串联电感(ESI)最小化的固体电解电容器。 固体电解电容器包括主要包括正电极体的电容器元件,其具有嵌入其中的正电极引线,并且由任何形式的阀金属制成,例如网,片,箔,及其变型,其具有 粗糙的表面; 与正极引线连接的正极端子; 连接到负极层的负极端子; 和通过模制涂覆的外壳树脂。 这提高了电容元件的安装效率,有助于固体电解电容器的薄型结构。

    Chip-type filter
    6.
    发明授权
    Chip-type filter 有权
    片式过滤器

    公开(公告)号:US07612987B2

    公开(公告)日:2009-11-03

    申请号:US12368569

    申请日:2009-02-10

    IPC分类号: H01G9/00

    摘要: A chip-type filter has a laminated body formed by stacking a plurality of capacitor elements, a pair of positive electrode terminals, a pair of negative electrode terminals, insulating outer resin, and an inductor section. The laminated body includes capacitor elements in a first group and capacitor elements in a second group, the positive electrode sections in both groups are disposed on the opposite sides with respect to the negative electrode sections. Positive electrode terminals are electrically connected to the positive electrode sections of capacitor elements in the first group and those of capacitor elements in the second group, respectively. Negative electrode terminals are electrically connected to the negative electrode sections in the laminated body, and are disposed at both ends of the direction crossing the connecting direction between the positive electrode terminals. The inductor section is insulated from the negative electrode sections and couples the positive electrode terminals.

    摘要翻译: 芯片型滤波器具有通过堆叠多个电容器元件,一对正极端子,一对负极端子,绝缘外部树脂和电感器部分而形成的层叠体。 层叠体包括第一组中的电容器元件和第二组中的电容器元件,两组中的正极部分相对于负极部分设置在相对侧上。 正极端子分别电连接到第一组中的电容器元件的正极部分和第二组中的电容器元件的正极部分。 负极端子与层叠体中的负极部电连接,并且配置在与正极端子之间的连接方向交叉的方向的两端。 电感器部分与负极部分绝缘并连接正极端子。

    Capacitor device and fabricating method thereof
    8.
    发明授权
    Capacitor device and fabricating method thereof 失效
    电容器件及其制造方法

    公开(公告)号:US07206185B2

    公开(公告)日:2007-04-17

    申请号:US10734290

    申请日:2003-12-15

    IPC分类号: H01G2/00

    摘要: The invention relates to a capacitor device comprising the combination of a cylindrical capacitor and a holder for holding the capacitor in a sideways position. The holder includes a capacitor holding part that has an opening at the top and is arc-shaped in cross section, and a mounting part for mounting the holder itself to another device. The capacitor is held in a sideways position in the holding part of the holder with a heat shrinking resin tube interposed therebetween. Accordingly, the height of the capacitor device is reduced, so that the size of the capacitor device can be reduced. In addition, the connection distance between the capacitor device and another electronic device is shortened, so that the inductance can be made smaller.

    摘要翻译: 本发明涉及一种电容器装置,其包括圆柱形电容器和用于将电容器保持在侧面位置的保持器的组合。 保持器包括电容器保持部分,其在顶部具有开口并且具有横截面的弧形,以及用于将保持器本身安装到另一装置的安装部。 电容器被保持在保持器的保持部分的侧向位置,其间插有热收缩树脂管。 因此,电容器器件的高度减小,从而可以减小电容器器件的尺寸。 此外,电容器装置与另一电子装置之间的连接距离缩短,使得可以使电感更小。

    Method of manufacturing solid electrolytic capacitors
    9.
    发明授权
    Method of manufacturing solid electrolytic capacitors 有权
    固体电解电容器的制造方法

    公开(公告)号:US06280483B1

    公开(公告)日:2001-08-28

    申请号:US09493003

    申请日:2000-01-28

    IPC分类号: H01G900

    摘要: A method of manufacturing solid electrolytic capacitors which prevents decrease in product yield due to degradation in characteristics of anode foil during a process of forming a MnO2 layer, and achieves high quality solid electrolytic capacitors with high yield, wherein aluminum foil is sampled from each lot before inputting the lot into the next process of forming MnO2 layer on a surface of aluminum foil, and a predetermined inspection is implemented after forming the MnO2 layer on this sample. Based on inspection results, the lot of the sample is input to the next process. This method prevents occurrence of defects in the MnO2 layer formation process in advance, and avoids finding defects after inputting the entire lot of aluminum foil to the MnO2 layer formation process. Consequently, highly reliable solid electrolytic capacitors are manufactured inexpensively and stably without loss in costs and efficiency.

    摘要翻译: 一种制造固体电解电容器的方法,其防止了在形成MnO 2层的过程中由于阳极箔的特性劣化而导致的产品收率降低,并且实现了高产量的高质量固体电解电容器,其中铝箔是从每个批次中取样的 将该批次输入到在铝箔的表面上形成MnO 2层的下一个工序中,在该样品上形成MnO 2层之后,进行规定的检查。 根据检查结果,样本的大量输入到下一个过程。 该方法预先防止了MnO2层形成过程中的缺陷的发生,并且避免了在将大量的铝箔输入到MnO 2层形成过程之后发现缺陷。 因此,廉价且稳定地制造高可靠性的固体电解电容器,而不会降低成本和效率。

    CHIP TYPE SOLID ELECTROLYTIC CAPACITOR
    10.
    发明申请
    CHIP TYPE SOLID ELECTROLYTIC CAPACITOR 有权
    芯片型固体电解电容器

    公开(公告)号:US20100259868A1

    公开(公告)日:2010-10-14

    申请号:US12821568

    申请日:2010-06-23

    IPC分类号: H01G9/012

    摘要: A chip type solid electrolytic capacitor includes a capacitor element-laminate. In the capacitor element-laminate, a plurality of capacitor elements, each having an anode portion and a cathode portion, are laminated so that the anode portions of the adjacent capacitor elements are disposed in the direction opposite to each other. Anode lead terminals are joined to the bottom faces of the anode portions of the capacitor elements disposed at both ends of the capacitor element-laminate. A cathode lead terminal is joined to the bottom face of the cathode portion of the capacitor element disposed in the center of the capacitor element-laminate. An Electrically insulating exterior resin coats the capacitor element-laminate so as to expose at least a part of the bottom faces of the anode lead terminals and a part of the cathode lead terminal.

    摘要翻译: 芯片型固体电解电容器包括电容器元件层叠体。 在电容器元件层叠体中,层叠多个具有阳极部和阴极部的电容器元件,使得相邻的电容器元件的阳极部沿相反方向配置。 阳极引线端子连接到设置在电容器元件 - 层叠体的两端的电容器元件的阳极部分的底面。 阴极引线端子连接到设置在电容器元件 - 层叠体的中心的电容器元件的阴极部分的底面。 电绝缘外部树脂涂覆电容器元件层压体,以暴露阳极引线端子和阴极引线端子的一部分的至少一部分底面。