公开(公告)号：US20220254577A1

公开(公告)日：2022-08-11

申请号：US17628226

申请日：2019-08-27

申请人： Mitsubishi Electric Corporation

发明人： Yasutomo TANIHARA ,  Hiroyuki CHIBAHARA ,  Taiki DONEN ,  Satoshi OCHI ,  Yuichi TAKAI

IPC分类号： H01H1/025 ,  H01H33/664 ,  H01H11/04

摘要： The present disclosure aims to provide an electrical contact to which a low boiling point metal is added, the electrical contact being able secure both mechanical strength and conductivity at the same time. The electrical contact according to the present disclosure includes a base material made of Cu, particles of a high melting point substance dispersed in the base material, the particles being made of at least one of a high melting point metal or a carbide of the high melting point metal, and Te and Ti dispersed in the base material, wherein, the Te of 3.5 to 14.5 mass % is added where the total is 100 mass %, and Ti/Te is 0.12 to 0.38.

公开(公告)号：US20190051475A1

公开(公告)日：2019-02-14

申请号：US16078088

申请日：2017-01-20

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Hiroyuki CHIBAHARA

IPC分类号： H01H33/664 ,  B22D19/00 ,  H01H11/04 ,  H01H1/02

摘要： A contact member according to the present invention includes: a contact layer composed of a plate-shaped porous body containing a high-melting-point metal as a main constituent and infiltrated with an infiltrant containing a low-melting-point metal as a main constituent; a contact-layer supporting part composed of the infiltrant; and a contact-part holding conductor composed of the infiltrant, wherein, the porous body is provided with an opening at the center of the contact layer and a portion from the opening to the contact-part holding conductor is continuously and integrally molded with the infiltrant.

公开(公告)号：US20200277688A1

公开(公告)日：2020-09-03

申请号：US16759926

申请日：2018-07-13

申请人： Mitsubishi Electric Corporation

发明人： Yasutomo TANIHARA ,  Hiroyuki CHIBAHARA ,  Taiki DONEN ,  Satoshi OCHI ,  Takayuki ITOTANI,

IPC分类号： C22C29/08 ,  H01H33/662 ,  H01H33/664

摘要： In an electric contact including a base material, high-melting-point substance particles, and an intermetallic compound, the intermetallic compound containing a MnX compound (X represents Te or Se) and a compound of a Mn—Cu solid-solution phase and X, is dispersed in the base material. If the Vickers hardness of the high-melting-point substance particles is higher than 0 Hv and lower than 200 Hv, the particle diameter of the high-melting-point substance particles is not smaller than 0.1 μm and not larger than 100 μm. If the Vickers hardness of the high-melting-point substance particles is 200 Hv or higher, the particle diameter is not smaller than 0.1 μm and not larger than 10 μm. The mass of X atoms is not lower than 1.5 mass % and not higher than 15 mass %. The atomic weight ratio Mn/(Mn+X) is not lower than 20 at % and not higher than 80 at %.

公开(公告)号：US20220389546A1

公开(公告)日：2022-12-08

申请号：US17770294

申请日：2019-12-13

申请人： Mitsubishi Electric Corporation

发明人： Yasutomo TANIHARA ,  Hiroyuki CHIBAHARA

IPC分类号： C22C38/14 ,  C22C38/04 ,  C22C38/10

摘要： A Super Invar alloy includes Ni of 30 to 35 percent by mass, Co of 3 to 6 percent by mass, Ti of 0.02 to 1.0 percent by mass, Mn of 0 to 0.2 percent by mass, an inevitable impurity including S, and the balance Fe. The Super Invar alloy does not include an additive other than Ti and Mn, as an additive. The Super Invar alloy includes the Ni of 32.3 to 32.5 percent by mass, the Co of 4.4 to 5.1 percent by mass, the Ti of 0.02 to 1.0 percent by mass, and the S of 0.007 to 0.1 percent by mass. The Super Invar alloy is an alloy having good high temperature ductility, low hot crack sensitivity, and low thermal expansibility of equal to or lower than 1 ppm/° C. It is applicable to use Zr or Hf instead of Ti.