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公开(公告)号：US10539607B2
公开(公告)日：2020-01-21
申请号：US15588783
申请日：2017-05-08
发明人： Akira Okada , Kinya Yamashita , Masaki Ueno
IPC分类号： G01R31/00 , G01R31/26 , H01L21/683 , H01L21/687
摘要： An evaluation apparatus includes an insulating plate, a plurality of probes fixed to the insulating plate, an insulating portion having a connection portion connected to the insulating plate in a detachable manner and a tip portion continuous with the connection portion, the tip portion being narrower than the connection portion, an insulator formed by combining the insulating portions to surround the plurality of probes in planar view, and an evaluation unit for passing currents through the plurality of probes to evaluate electrical characteristics of an object to be measured.
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公开(公告)号：US11624767B2
公开(公告)日：2023-04-11
申请号：US17386032
申请日：2021-07-27
发明人： Yasushi Takaki , Kinya Yamashita , Masaki Ueno
摘要： A semiconductor test apparatus according to the present disclosure includes: a stage on which a wafer is to be mounted; a pressurizing wall disposed on a surface of a probe card opposing the stage, extending toward the stage, and having an opening; a mark disposed on a lower surface of the pressurizing wall opposing the stage; a probe disposed in the opening; an air tube to force air into the opening; a detector to detect first spacing between a tip of the probe and the mark; and a controller to control second spacing between the wafer and the lower surface of the pressurizing wall based on the first spacing, wherein, when an electrical property of each of chips of the wafer is measured, the second spacing is controlled to be predetermined spacing by the controller, and the air is forced into the opening through the air tube.
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公开(公告)号：US10436833B2
公开(公告)日：2019-10-08
申请号：US15676393
申请日：2017-08-14
发明人： Akira Okada , Kinya Yamashita , Masaki Ueno , Takaya Noguchi
摘要： Provided is a technique capable of preventing occurrence of partial discharge. An evaluation apparatus includes a probe disposed on an undersurface of an upper component; a sidewall part disposed on the undersurface of the upper component and enclosing sides of the probe; and a first gas supplying part. The first gas supplying part is capable of supplying a gas to a to-be-measured object that is placed on a stage when the sidewall part comes in proximity to the stage, and to a space enclosed by the stage, the sidewall part, and the upper component when the sidewall part is in contact with the stage.
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