公开(公告)号：US11414220B2

公开(公告)日：2022-08-16

申请号：US16080213

申请日：2017-02-01

申请人： Mitsubishi Electric Corporation

发明人： Hiroki Izu ,  Yuichi Ogura ,  Takehide Nomura ,  Kengo Hayashi ,  Shintaro Yamashita ,  Shiro Sakata ,  Tetsuya Kitagawa

IPC分类号： B64G1/50 ,  F28D15/02 ,  B64G1/58 ,  F28D15/04

摘要： Inner panels including at least one built-in heat pipe connected in a circumferential direction are provided. In a heat pipe panel including the built-in heat pipe, apparatuses are mounted on the outer side of the plural inner panels connected in the circumferential direction to diffuse generated heat of the apparatuses to the circumferential direction of the inner panels. Webbed panels including a built-in heat pipe horizontally arranged and having heat radiation surfaces are radially arranged at corners of the inner panels as well as a heat pipe is horizontally built in and heat radiation surfaces are arranged also on outer panels facing the inner panels to thermally connect the heat pipes to one another.

公开(公告)号：US10895586B2

公开(公告)日：2021-01-19

申请号：US15679186

申请日：2017-08-17

申请人： Mitsubishi Electric Corporation

发明人： Tetsuya Kitagawa ,  Masayuki Kubota ,  Motoyoshi Koyanagi ,  Tomohito Taniuchi ,  Daisuke Ikeda ,  Kazuhiro Sasano ,  Yuji Kobayashi

IPC分类号： G01R1/04

摘要： A semiconductor inspection jig includes: a base on which a semiconductor device is placed; and a substrate provided on the base and including a conductive pattern, wherein the conductive pattern intersects with a lead of the semiconductor device placed on the base from a direction other than a horizontal direction with respect to the lead, and is in contact with an intermediate part of the lead without being in contact with a leading end of the lead.