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    Tape with Built-In Ic Chip, Production Method Thereof, and Sheet with Built-In Ic Chip
    1.
    发明申请
    Tape with Built-In Ic Chip, Production Method Thereof, and Sheet with Built-In Ic Chip 审中-公开
    带内置IC芯片的胶带，其制作方法和内置IC芯片的片材

    公开(公告)号：US20070259175A1

    公开(公告)日：2007-11-08

    申请号：US11575131

    申请日：2005-09-13

    申请人： Mitsuhiro Ayaki ,  Nobuo Kanda ,  Shiro Sugimura ,  Hideki Kobayashi ,  Tuyoshi Ozaki ,  Keitaro Tomita ,  Keiichi Utaka ,  Mitugi Saito

    发明人： Mitsuhiro Ayaki ,  Nobuo Kanda ,  Shiro Sugimura ,  Hideki Kobayashi ,  Tuyoshi Ozaki ,  Keitaro Tomita ,  Keiichi Utaka ,  Mitugi Saito

    IPC分类号： A01K1/015 ,  B65C9/25

    CPC分类号： G06K19/07 ,  G07D7/01 ,  Y10T428/249921 ,  Y10T428/2848

    摘要： The present invention relates to a sheet with at least one built-in IC chip, the sheet being scarcely influenced by a mechanical external force and being free from loss or damage of the IC chip, and relates to a tape with at least one built-in IC chip used for the sheet with at least one built-in IC chip. The tape with at least one built-in IC chip is characterized in that a part or all of the IC chip 10 is embedded in a recessed portion 20a formed on a tape body, and the tape body 20 includes: a first base material 21; an adhesive layer 22 laminated on the first base material and formed of an adhesive; and a second base material 23 laminated on the adhesive layer; the second base material 23 being removed from the recessed portion 20a and the periphery thereof, and the adhesive in the recessed portion 20a of the adhesive layer 22 being pushed to the periphery thereof, and the pushed adhesive filling in a gap between the periphery of the IC chip 10 and the second base material 23.

    摘要翻译： 本发明涉及具有至少一个内置IC芯片的片材，该片材几乎不受机械外力的影响并且不会损失或损坏IC芯片，并且涉及具有至少一个内置IC芯片的带， 在IC芯片中用于具有至少一个内置IC芯片的片材。 具有至少一个内置IC芯片的带的特征在于，IC芯片10的一部分或全部嵌入形成在带体上的凹部20a中，带体20包括：第一基材21 ; 层压在第一基材上并由粘合剂形成的粘合剂层22; 和层叠在粘合剂层上的第二基材23; 第二基材23从凹部20a及其周边除去，粘合剂层22的凹部20a中的粘合剂被推到其周围，并且被挤压的粘合剂填充在周边 的IC芯片10和第二基材23。