摘要:
An object is to provide an induction heating method having a high power factor in which when thermal processing is performed through a plurality of heating coils receiving the supply of the current to generate mutual induction. In an induction heating method using an induction heating device that includes self-resonant circuits which feeds currents of equal frequency to a plurality of heating coils receiving the supply of the current to generate mutual induction is connected, wherein adjustment or control is performed to carry out an operation such that a first ratio of a reactance component of a mutual induction impedance to a resistance component of the mutual induction impedance between the adjacent self-resonant circuits and a second ratio of a reactance component of a self-impedance to a resistance component of the self-impedance in the self-resonant circuit are made equal to each other.
摘要:
A control is performed so that phase angles of outputs from resonant inverters fall within a predetermined range under a mutual induction environment. An inductive heating device (100) includes: a plurality of resonant inverters (30a, 30b) that supply power to a plurality of inductive heating coils (La, Lb), respectively, under a mutual induction environment; and a control circuit (40) that aligns drive frequencies so as to be in common among the resonant inverters and controls the drive frequencies commonly so that phase angles of the outputs from the plurality of the resonant inverters fall within a predetermined range. In addition, the control circuit individually controls coil currents flowing through the inductive heating coils so that the phase angles fall within a predetermined range.
摘要:
A control is performed so that phase angles of outputs from resonant inverters fall within a predetermined range under a mutual induction environment. An inductive heating device (100) includes: a plurality of resonant inverters (30a, 30b) that supply power to a plurality of inductive heating coils (La, Lb), respectively, under a mutual induction environment; and a control circuit (40) that aligns drive frequencies so as to be in common among the resonant inverters and controls the drive frequencies commonly so that phase angles of the outputs from the plurality of the resonant inverters fall within a predetermined range. In addition, the control circuit individually controls coil currents flowing through the inductive heating coils so that the phase angles fall within a predetermined range.
摘要:
[Object] An object is to provide an induction heating method having a high power factor in which when thermal processing is performed through a plurality of heating coils receiving the supply of the current to generate mutual induction, it is possible to easily and rapidly perform synchronization control on a coil current and in which when the current is varied, even if the speed of control on the current value is increased, this little affects an inverter phase angle.[Solving means] In an induction heating method using an induction heating device that heats an item to be heated and includes a plurality of self-resonant circuits to which a resonant high-frequency power supply feeding currents of equal frequency to a plurality of heating coils receiving the supply of the current to generate mutual induction is connected, the phases of impedances within a system are made to coincide with each other to minimize the phases. From the time of starting up, the phase is made to become an inverter phase that can bring the phase difference of the currents close to zero. Control on the frequency and the current value is performed so that the inverter phase is controlled within a given range.
摘要:
A semiconductor substrate thermal treatment apparatus enables excellent heating control in suppressing influence of mutual induction between induction heating coils even when the induction heating coils are arranged in the vertical direction while providing horizontal magnetic flux to susceptors. The apparatus indirectly heats wafers mounted on horizontally-arranged susceptors including induction heating coils to form alternate-current magnetic flux in a direction parallel to a mount face of the susceptor. The wafer are arranged at an outer circumferential side of the susceptor. The induction heating coils are structured with at least one main heating coil and subordinate heating coils electromagnetically coupled with the main heating coil. Inverse coupling coils inversely-coupled to the subordinate heating coils are provided to the main heating coil, and zone control means separately controls a power ratio while synchronizing frequencies and current waveforms of current to the main heating coil and adjacent subordinate heating coils.