公开(公告)号：US6036375A

公开(公告)日：2000-03-14

申请号：US923928

申请日：1997-07-24

申请人： Mitsuo Yanagisawa ,  Kenichi Ura ,  Satoru Tomie

发明人： Mitsuo Yanagisawa ,  Kenichi Ura ,  Satoru Tomie

IPC分类号： G02B6/42 ,  G02B6/36

CPC分类号： G02B6/4248 ,  G02B6/4204

摘要： The invention relates to an optical semiconductor device housing package comprising a base having a mounting portion on an upper surface of which an optical semiconductor device is mounted; a frame attached to the base so as to encircle the mounting portion, the frame having a through-hole in one side thereof; a cylindrically shaped fixing member into which an optical fiber is inserted, the cylindrically shaped fixing member being fixed to the through-hole of the frame; a light-transmitting member attached to one end portion of the fixing member; and a lid member mounted on an upper face of the frame, for hermetically sealing the optical semiconductor device, wherein the light-transmitting member is formed of amorphous glass.

摘要翻译： 本发明涉及一种光学半导体器件壳体封装，其包括：基座，其上表面上具有安装光学半导体器件的安装部分; 框架，其安装在所述基座上以围绕所述安装部分，所述框架在其一侧具有通孔; 圆柱形的固定构件，其中插入光纤，所述圆柱形固定构件固定到所述框架的通孔; 安装在所述固定构件的一个端部的透光构件; 以及盖构件，其安装在所述框架的上表面上，用于气密地密封所述光学半导体器件，其中所述透光构件由非晶玻璃形成。