公开(公告)号：US08029152B2

公开(公告)日：2011-10-04

申请号：US11909592

申请日：2006-03-23

申请人： Fumiaki Sekine ,  Daisuke Sakumoto ,  Yuki Mori ,  Mitsuo Yanagisawa ,  Shingo Matsuura

发明人： Fumiaki Sekine ,  Daisuke Sakumoto ,  Yuki Mori ,  Mitsuo Yanagisawa ,  Shingo Matsuura

IPC分类号： F21V9/16

CPC分类号： H01L33/60 ,  H01L33/62 ,  H01L2224/16

摘要： A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.

摘要翻译： 一种包装体，包括具有用于安装发光装置的安装部的基体，安装在基体的上表面的框状的第一反射构件，其内周面成形为第一光反射面， 围绕安装部的框状的第二反射构件和安装在基体的上表面的框状的第二反射构件，其间隔固定在第二反射构件的内周面与第一反射构件的外周面之间， 围绕第一反射构件的周边表面，并且在第一反射构件的上端上方的位置具有第二光反射表面。

公开(公告)号：US20050133808A1

公开(公告)日：2005-06-23

申请号：US10978302

申请日：2004-10-29

申请人： Mitsugu Uraya ,  Daisuke Sakumoto ,  Akira Miyake ,  Fumiaki Sekine ,  Yuki Mori ,  Mitsuo Yanagisawa ,  Hiroshi Shibayama ,  Shingo Matsuura

发明人： Mitsugu Uraya ,  Daisuke Sakumoto ,  Akira Miyake ,  Fumiaki Sekine ,  Yuki Mori ,  Mitsuo Yanagisawa ,  Hiroshi Shibayama ,  Shingo Matsuura

IPC分类号： H01L33/38 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

CPC分类号： H01L33/486 ,  B41J2/455 ,  H01L33/508 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting apparatus provides a ceramic-made base body, a frame body, a light-emitting element, a conductor layer and a light-transmitting member. The base body has on its upper surface a mounting portion for the light-emitting element. The frame body is joined to the upper surface of the base body so as to surround the mounting portion, with its inner peripheral surface shaped into a reflection surface. The wiring conductor has its one end formed on the upper surface of the base body and electrically connected to the light-emitting element, and has another end led to a side or lower surface of the base body. The light-transmitting member is disposed inside the frame body so as to cover the light-emitting element, which contains fluorescent materials for performing wavelength conversion. The base body is so designed that ceramic crystal grains range in average particle diameter from 1 to 5 μm.

摘要翻译： 发光装置提供陶瓷制的基体，框体，发光元件，导体层和透光构件。 基体在其上表面上具有用于发光元件的安装部分。 框架体以围绕安装部的方式与基体的上表面接合，其内周面形成为反射面。 布线导体的一端形成在基体的上表面上并与发光元件电连接，另一端被引导到基体的侧面或下表面。 透光构件设置在框体内，以覆盖包含用于进行波长转换的荧光材料的发光元件。 基体的设计使得陶瓷晶粒的平均粒径范围为1〜5μm。

公开(公告)号：US06426591B1

公开(公告)日：2002-07-30

申请号：US09405961

申请日：1999-09-27

申请人： Mitsuo Yanagisawa ,  Hisaki Masuda

发明人： Mitsuo Yanagisawa ,  Hisaki Masuda

IPC分类号： H01J6304

CPC分类号： H01L31/0203 ,  G02B6/4204 ,  G02B6/4236 ,  G02B6/424 ,  G02B6/4251 ,  G02B6/4267 ,  G02B6/4271 ,  G02B6/4272 ,  H01L2924/16195 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A package for housing a photosemiconductor element comprises a substrate having a mounting portion on a top surface of which a photosemiconductor element is mounted, a frame attached onto the substrate to surround the mounting portion and having a through hole on a side thereof, a cylindrical fixing member attached around the through hole of the frame and having a space therein for transmitting an optical signal, a light transmitting member attached to the cylindrical fixing member, for clogging the inside of the fixing member and a lid attached onto a top surface of the frame, hermetically sealing the photosemiconductor element. The fixing member is made of an alloy of from 40 to 60 wt % iron and from 40 to 60 wt % nickel. The coefficient of thermal expansion of the fixing member is about 9.5×10−6/° C. (room temperature to 400° C.), which is close to that of the light transmitting member of amorphous glass, so that no thermal stress caused by the difference in coefficient of thermal expansion occurs in attaching the two. Because there is no thermal stress, which causes the double-refraction of the light excited by the photosemiconductor element, the excited light is received by the optical fiber member without being double-refracted in the light transmitting member, and the transmission efficiency of optical signal is enhanced.

摘要翻译： 一种用于容纳光半导体元件的封装，包括：基板，其上表面上安装有一个光半导体元件，一个安装在该基板上的框架，以围绕安装部分并在其一侧具有一个通孔;圆柱形固定 安装在框架的通孔周围并且在其中具有用于传输光学信号的空间的部件，附接到圆柱形固定部件的透光部件，用于堵塞固定部件的内部，以及附接到框架的顶面的盖 ，密封光半导体元件。 固定构件由40至60重量％的铁和40至60重量％的镍的合金制成。 固定部件的热膨胀系数约为9.5×10 -6 /℃（室温〜400℃），接近于非晶玻璃的透光部件的热膨胀系数，使得不产生热应力 在连接两者时发生热膨胀系数的差异。 由于没有热应力，这导致由光半导体元件激发的光的双折射，激发的光被光纤部件接收而不在光传输部件中被双折射，并且光信号的传输效率 增强了。

公开(公告)号：US6036375A

公开(公告)日：2000-03-14

申请号：US923928

申请日：1997-07-24

申请人： Mitsuo Yanagisawa ,  Kenichi Ura ,  Satoru Tomie

发明人： Mitsuo Yanagisawa ,  Kenichi Ura ,  Satoru Tomie

IPC分类号： G02B6/42 ,  G02B6/36

CPC分类号： G02B6/4248 ,  G02B6/4204

摘要： The invention relates to an optical semiconductor device housing package comprising a base having a mounting portion on an upper surface of which an optical semiconductor device is mounted; a frame attached to the base so as to encircle the mounting portion, the frame having a through-hole in one side thereof; a cylindrically shaped fixing member into which an optical fiber is inserted, the cylindrically shaped fixing member being fixed to the through-hole of the frame; a light-transmitting member attached to one end portion of the fixing member; and a lid member mounted on an upper face of the frame, for hermetically sealing the optical semiconductor device, wherein the light-transmitting member is formed of amorphous glass.

摘要翻译： 本发明涉及一种光学半导体器件壳体封装，其包括：基座，其上表面上具有安装光学半导体器件的安装部分; 框架，其安装在所述基座上以围绕所述安装部分，所述框架在其一侧具有通孔; 圆柱形的固定构件，其中插入光纤，所述圆柱形固定构件固定到所述框架的通孔; 安装在所述固定构件的一个端部的透光构件; 以及盖构件，其安装在所述框架的上表面上，用于气密地密封所述光学半导体器件，其中所述透光构件由非晶玻璃形成。

公开(公告)号：US5895873A

公开(公告)日：1999-04-20

申请号：US844919

申请日：1997-04-22

申请人： Mitsuo Yanagisawa

发明人： Mitsuo Yanagisawa

IPC分类号： G10D13/02

CPC分类号： G10D13/025

摘要： A snare drum design attaches snare string(s) in a manner to protect the snare string(s) from damage at the snare gate. More particularly, the snare drum design prolongs the useful life of snare strings by providing a friction resistance member along an inner periphery of a snare gate formed in the snare rim.

摘要翻译： 小圈鼓设计以一种方式附着圈套，以保护圈套不受圈套门的伤害。 更具体地，小鼓设计通过沿着形成在圈套边缘的圈套门的内周提供摩擦阻力构件来延长圈套绳的使用寿命。

公开(公告)号：US5610351A

公开(公告)日：1997-03-11

申请号：US608938

申请日：1996-02-29

申请人： Mitsuo Yanagisawa

发明人： Mitsuo Yanagisawa

IPC分类号： G10D13/00 ,  G10D13/02

CPC分类号： G10D13/006

摘要： A multi-task beater head having multiple striking surfaces for producing a variety of attack sounds, wherein the beater head may be adjusted or oriented in a convenient manner to achieve the desired attack sound. The drum beater incorporates a shaft that clamps into a receptor of a bass drum pedal, and a striker head that attaches to the other end of the shaft. The improved bass drum beater is molded from a hard plastic-type material or the like, and features a cube-like head with flat top and bottom surfaces and four faces, each with uniquely oriented convex shaped surfaces. The beater can be rotated by loosening the receptor of the bass drum pedal so that any of the plurality of surfaces is in position to strike the drum head. Thus, the percussionist can achieve a plurality of distinctly different bass drum sounds by choosing the appropriate surface.

摘要翻译： 一种具有多个撞击表面的多任务搅打头，用于产生各种攻击声音，其中可以以便利的方式调节或定向打击头，以实现所需的攻击声音。 鼓式打浆机包括夹在低音鼓踏板的接收器中的轴和连接到轴的另一端的撞针头。 改进的低音鼓式打浆机由硬塑料类材料等成型，其特征在于具有平坦的顶面和底面以及四面的立方体头部，每个面具有独特定向的凸形表面。 可以通过松开低音鼓踏板的接收器来旋转打浆机，使得多个表面中的任何一个都能够与鼓头相撞。 因此，打击乐器可以通过选择适当的表面来实现多种明显不同的低音鼓声音。

公开(公告)号：USD310538S

公开(公告)日：1990-09-11

申请号：US184707

申请日：1988-04-22

申请人： Mitsuo Yanagisawa

设计人： Mitsuo Yanagisawa

公开(公告)号：US5574237A

公开(公告)日：1996-11-12

申请号：US534579

申请日：1995-09-27

申请人： Mitsuo Yanagisawa

发明人： Mitsuo Yanagisawa

IPC分类号： G10D13/00 ,  G10D13/02

CPC分类号： G10D13/006

摘要： An improved foot pedal features a moveable heel piece and footboard with fore and aft motion along the pedal's base plate. By sliding the heel piece and footboard, the position of the top of the footboard can be changed in relation to the position of the pedal's wheel section, in turn changing the pulling direction of the chain which links the top of the footboard with the wheel section. By altering the pulling direction of the chain, the feel and action of the pedal is made relatively lighter or heavier allowing the drummer to customize the performance characteristics of the pedal beyond the typical range of the pedal adjustments.

摘要翻译： 改进的脚踏板具有可移动的跟部件和脚踏板，其具有沿着踏板基板的前后运动。 通过滑动跟部件和脚踏板，可以相对于踏板的车轮部分的位置改变脚踏板的顶部的位置，从而改变将脚踏板的顶部与车轮部分连接的链条的拉动方向 。 通过改变链条的拉动方向，踏板的感觉和作用变得相对较轻或更重，从而允许鼓手定制踏板的性能特征超出踏板调节的典型范围。

公开(公告)号：US4928566A

公开(公告)日：1990-05-29

申请号：US352103

申请日：1989-05-15

申请人： Mitsuo Yanagisawa

发明人： Mitsuo Yanagisawa

IPC分类号： G10D13/00 ,  G10D13/02

CPC分类号： G10D13/023

摘要： A pair of tension bolts for applying tension to a pair of drum heads are screwed individually into nuts. These nuts are held individually by means of a pair of lug bodies which are fixed to a drum shell. The lug bodies, which are formed by die casting, are connected to each other by means of a connecting member. The connecting member, which has a uniform cross-sectional shape throughout its length, is formed by pressing a metal plate with a predetermined length, or by cutting a metal pipe into a predetermined length. Two opposite end portions of the connecting member are fitted individually in openings at the respective end portions of the lug bodies. A hole is formed in each end portion of the connecting member. The lug bodies and the connecting member are connected so that projections on the lug bodies are fitted individually in the holes of the connecting member.

摘要翻译： 用于向一对鼓头施加张力的一对张紧螺栓单独拧入螺母。 这些螺母通过固定在鼓壳上的一对凸耳体分别固定。 通过压铸形成的凸耳体通过连接构件相互连接。 通过对预定长度的金属板进行压制，或者将金属管切割成预定长度，形成贯穿整个长度的横截面形状均匀的连接构件。 连接构件的两个相对端部分别装配在凸耳体的相应端部处的开口中。 在连接部件的各端部形成有孔。 凸耳体和连接部件连接，使凸耳体上的凸起分别安装在连接部件的孔中。

公开(公告)号：US20090152580A1

公开(公告)日：2009-06-18

申请号：US12056893

申请日：2008-03-27

申请人： Shingo Matsuura ,  Mitsuo Yanagisawa ,  Daisuke Sakumoto

发明人： Shingo Matsuura ,  Mitsuo Yanagisawa ,  Daisuke Sakumoto

IPC分类号： H01L33/00 ,  H01L21/02

CPC分类号： H01L33/54 ,  H01L33/507 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00012

摘要： A light-emitting chip includes a base, a transparent material layer and a light-emitting chip. The base has an upper surface including a conductive pattern. The transparent material layer is disposed on the upper surface of the base and has an opening part which is located on region at least part of the conductive pattern. The light-emitting chip is mounted on the conductive pattern and located in the opening part of the transparent material layer.

摘要翻译： 发光芯片包括基底，透明材料层和发光芯片。 底座具有包括导电图案的上表面。 透明材料层设置在基座的上表面上，并且具有位于导电图案的至少一部分的区域上的开口部。 发光芯片安装在导电图案上并且位于透明材料层的开口部分中。